INTERCONNECT ARRAY PATTERN WITH A 31 SIGNAL-TO-GR

更新时间:2023-05-20 13:20:46 阅读: 评论:0

专利名称:INTERCONNECT ARRAY PATTERN WITH A艺术表演
3:1 SIGNAL-TO-GROUND RATIO
发明人:Zhaoqing Chen,Matteo Cocchini,Rohan U.
Mandrekar,Tingdong Zhou
申请号:US14824125
申请日:20150812个人合伙协议
公开号:US20160149611A1
李恩珠电影公开日:
20160526
专利内容由知识产权出版社提供
专利附图:
摘要:An electronic device including a plurality of interconnects are orthogonally arranged in a grid pattern and evenly spaced by a first distance, the plurality of
interconnects include: a first conductor pair with conductors arranged next to each other in a first direction, the first direction is oriented diagonally relative to the orthogonal grid pattern, a cond conductor pair with conductors arranged next to each other in a cond direction substantially perpendicular to the first direction, each conductor of the cond conductor pair is spaced by the first distance from each signal conductor of the first conductor pair, and a third conductor pair with conductors arranged next to each other in a third direction substantially parallel to the first direction, each conductors of the third conductor pair is spaced by the first distance from one of the signal elements of the cond conductor pair.
新学期新气象申请人:International Business Machines Corporation
地址:Armonk NY US
皮卡丘怎么折
在职妻子国籍:US
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