三: 半导体各工艺简介
Wafer Manufacture
The integrated circuits are built on single crystal substrates that are mirror like discs called wafers. The
wafers are just a starting plate for the
fabrication of electronics such as
microchips and transistors. There are many materials that are ud but the most common material in manufacturing of miconductors is silicon . 1、单晶硅片的制备
英国下午茶Silicon has the basic diamond crystal structure –
two merged FCC cells offt by a/4 in x, y and z.
咸阳海泉湾
This is a 4 inch 100 plane crystal Silicon wafer, that is typically between 250-600 microns thick.
业态分类*the current standards are now up to 12 inch wafers*
Why Silicon?
Si在地壳中含量有25.8%, 相对于Ge有以下优点:
林佑威
1.工作温度高(带隙大);
2.氧化特性好;
中西伯利亚高原
3.表面张力大，比重小;信贷风险管理
4.其他如结晶性能，欧姆接触性质好;
多晶硅的制备：
Silicon is usually obtained from the common sand or silica. Sand is compod of silicon dioxide and so usually a very pure quartzite sand is lected. The sand is heated while applying carbon in forms of coke, coal, and wood chips. In turn oxygen blows off as carbon monoxide, leaving bulky chunks of silicon in
Metallurgical Grade Silicon. At this point, the MGS material is approximately 98-99% pure.
1600-1800°C
心理需求SiO2+3C SiC+2CO
SiC+SiO23Si +2COall什么意思
工业硅的获得
