A a
A.O.I(Automatic Optical Inspection)自动光学检查Acceptable quality level (AQL)可接受质量水平Accuracy精确度Activating活化
Active carbon treatment活性碳处理After Presd Thickness压板后之厚度Alignment校直，结盟Annular ring锡圈
Anti-Static Bag静电胶袋Apparatus设备，仪器Area面积
Artwork菲林
贴福字Artwork Drawing菲林图形Artwork Film原装菲林Artwork Modification菲林修改Artwork No.菲林编号Asmbly组装，装配Axis轴
有理数的乘法法则
工科和理科的区别B b
Backplane背板
Back-up垫板
Baking 烘板
教师资格证分类Ball Grid Array (BGA)球栅阵列
Bare board裸板
Ba Copper底铜
Ba material基材
Bevelling斜边
Black Oxide黑氧化
Blind via hole盲孔Blistering起泡/水泡Board Cutting开料
Board Thickness板厚
Bottom side底层Breakaway tab打断点Brushing磨刷
Build-up积层
Bullet pad子弹盘
Buried hole埋孔
C c
C/M(Component Marking)元件字符Carbon ink碳油
Carrier带板Ceramic substrate陶瓷Certificate of Compliance合格证书Chamfer倒角Chemical cleaning化学清洗Chemical corrosion化学腐蚀Chip Scale Package (CSP)晶片比例包装Circuit线路Clearance间距/间隙Color颜色Component Side(C/S)元件面Composite layers复合层Computer Aided Design (CAD)电脑辅助设计Computer Aided Manufacturing (CAM)电脑辅助制作Computer Numerial Control (CNC)数控Conductor导体Conductor width/space导体线宽/线隙Contact接点
Copper area铜面积Copper clad铜箔
Copper foil铜箔
英雄联盟段位排序
Copper plating0电镀铜Corner角线
Corner mark板角记号Corner REG.Hole角位对位孔Cracking裂缝Creasing皱折
Criteria规格，标准Crosction area切面
Cu/Sn Plating镀铜锡Current efficiency电流效率Customer客户Customer Drilling File客户钻孔资料Customer P/N客户产品编号D d
D/F Registration Hole干菲林对位孔D/F(Dry Film)干膜
Date Code日期代号Datum hole基准参考孔Daughter board子板Deburring去毛刺Defect缺陷Definition定义Delamination分层
Delay耽搁Delivery交货Densitomefer透光度计Density密度Department部门Description说明
Design origin设计原点Desmear去钻污，除胶Dessicant防潮珠Developer显影液，显影机Diamond钻石
牛黄清宫丸Diazo film重氮片Dielectric breakdown介电击穿Dielectric constant介电常数Dielectric Thickness介电层厚度Dielectric Voltage Test绝缘测试Dimension尺寸Dimensional stability尺寸稳定性Direct/indirect直接/间接Distribution发放Document type文件种类Documentation Control文件控制Double sided board双面板
Drill bit钻咀
文明礼仪的句子
Drilling钻孔
Drilling Roughness钻孔粗糙度Dry Film 干菲林
Dry Film-Pattern干膜线路Dynamic动态
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E e
ECN(Engineering Change Notification)工程更改通知Effective date有效期Electrical Test Fixture电测试 针床Electro migration漏电Electroconductive paste导电胶Electroless无电沉Electroless copper无电沉铜Electroless Ni无电沉镍Electroless Gold/Au无电沉金Engineering drawing工程图纸
Entek有机涂覆Epoxy glass substrate环氧玻璃基板Epoxy resin环氧基树脂Etch蚀刻
Etchback凹蚀
Etching蚀刻
E-Test Marking电测试标记
E-Test(Electrical Test)电测试Exposure曝光
External layer外层
F f
言而无信不知其可Fiducial mark基准点
Filling填充
Film Fabrication菲林制作
Final QC最终检查Finish Overall Board Thickness成品总板厚度Fixture夹具Flammability可燃性
Flash Gold薄金
Flexible易曲的，能变形的Flux助焊剂
G g
General information一般资料Ghost image重影
Glass transition temperature玻璃化湿度Gold Finger(G/F)金手指
Golden board金板
Grid网格
Ground plane地线层
H h
HAL(Hot Air Leveling)热风整平Hand Rout手锣Hardness硬度
Heat Sealed热密封Heat Shrink-warp热收缩Holding time停留时间Hole孔
Hole breakout破环
Hole density孔的密度Hole Diameter孔径
Hole location孔位
Hole Location Chart孔位坐标表Hole Position Tolerance孔位误差Hole size孔尺寸
Hot Air Leveling(HAL)热风整平Humidity湿度
I
Identification标识，指标Image影像Imaging transfer图形转移Impedance阻抗Impedance Test阻抗测试Inner copper foil 内层铜箔Inspection检验Insulation resistance Test绝缘测试Inter Plane Separation内层分离Interleave Paper隔纸Internal layer内层Internal stress内应力Ionic cleanliness离子清洁度Isolation孤立Isolation Resistance绝缘电阻Item项目
K k
KEY board按键盘
