METHOD FOR CUTTING OF SEMICONDUCTOR WAFER

更新时间:2023-05-15 10:50:06 阅读: 评论:0

女巫们专利名称:METHOD FOR CUTTING OF国内旅游景点排行
SEMICONDUCTOR WAFER
发明人:WADA MASARU,ITOU KUNIO,SUGINO TAKASHI
申请号:JP13490380
申请日:19800927捉鱼的拼音
牧童教案
公开号:JPS5759334A
公开日:
电算化会计
飞行器简笔画
19820409
专利内容由知识产权出版社提供
摘要:PURPOSE:To increa the reliability of a miconductor element by a method wherein supersonic waves are applied to the blade which comes in contact with the miconductor single crystal wafer and the cleavage of the wafer, having small crystal distortion, is formed at a plurality of spots simultaneously. CONSTITUTION:The blade 2 of a knife is brought into contact with the circumferential ction of a (100) GaAs single crystal wafer 1 and, at the same time, the supersonic waves generated by the supersonic waves generator 3 are applied to the above. A cleavage is easily formed without having a distortion on the crystal. Accordingly, the cleavages having no distortion on the crystal can be formed at two spots or more simultaneously.
申请人:MATSUSHITA DENKI SANGYO KK
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