Etchant and array substrate having copper lines et

更新时间:2023-05-15 04:48:33 阅读: 评论:0

专利名称:Etchant and array substrate having copper
lines etched by the etchant
裨补阙漏怎么读
发明人:Gyoo-Chul Jo,Ki-Sung Chae
申请号:US10015650
申请日:20011217
紫菜炒饭公开号:US06780784B2
公开日:
少年中国梦
20040824
专利内容由知识产权出版社提供
paragliding
专利附图:
销售员培训摘要:A method of forming an array substrate for u in a thin film transistor liquid crystal display (TFT-LCD) device includes forming a first metal layer on a substrate,
清炖鸡块
patterning the first metal layer to form a gate line and a gate electrode extended from
the gale line, forming a gate insulation layer on the substrate to cover the patterned first metal layer, forming an active layer on the gate insulation layer and over the gate electrode, forming an ohmic contact layer on the active layer, forming a cond metal layer on the gate insulation layer to rover the ohmic contact layer and the active layer, forming a third copper metal layer on the cond metal layer, simultaneously patterning the cond metal layer and the third copper metal layer to form a double-layered data line, a double-layered source electrode and a double-layered drain electrode using an etchant that includes hydrogen peroxide (HO), a HOstabilizer, and a neutral salt, and forming a pixel electrode contacting the double-layered drain electrode.
经验管理
申请人:LG. PHILIPS LCD CO., LTD.
代理机构:Morgan, Lewis & Bockius LLP
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>香樟树的果实

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