Learning Substrate Technology喝什么治疗慢性咽炎
From
End-customer’s Perspectives
呂宗興
Charlie Lu随笔作文500字
載板工程師應該具備的IC 封裝知識
BGA / Flip Chip
封裝可靠性測試
與載板間的關係
從使用者角度學習
IC載板製程技術
凤庆核桃
6寸奶油蛋糕掉球
金屬介面反應理論在IC封裝及SMT的應用
載板工程師基本訓練課程
Outline
•Wire-bonding process v.s. Flip chip process •Frequent en defect modes
–Relationship between substrate and package •Various substrate Mfg. technology
–Tenting process
–Etching back
–GPP (full body gold, double image)
–Selective gold
Wire-bonding v.s. Flip Chip
为您
•Wire-bonding
–Die attach:政治道德
epoxy adhesives –Die attach curing
–(plasma clean)
–Wire bonding
–(plasma clean)
–Molding
–Post-mold cure
卒读是什么意思
–Ball mount •Flip chip
–Die attach:
solder reflow
–Flux cleaning
–Substrate baking
–plasma cleaning
–Underfilling
–Underfill curing
–(ring / lid attach or molding)
–Ball mount
rice什么意思
Substrate
Frequent Seen Defect Modes –Substrate Related •Warpage
–Die attach failed
•Bonding pad contamination
–Stitch lift
•Substrate / mold cap delam
•Cu trace crack / Via crack
•Solder ball drop-off (missing ball)
–Either assy related or substrate related
•Solder ball pad peeling
•Short failure due to “foreign material”
Substrate Process Overview
