Integrated circuit packaging process

更新时间:2023-05-14 07:15:52 阅读: 评论:0

专利名称:Integrated circuit packaging process 发明人:Rusll V. Solstad
申请号:US06/828876
申请日:19860213
中南财经政法大学首义校区公开号:US04689875A
咸鹅公开日:
长白山好玩吗
19870901
专利内容由知识产权出版社提供
关于生死的名言看透人心摘要:The prent invention is a method for packaging and protecting an integrated circuit chip on a carrier tape. A carrier tape comprising at least two bonded layers (one layer being made of an electrically conductive material) includes small flat leads in the conductive layer. A carrier bridge or frame of nonconductive material is bonded to one surface of the leads and is connected to a nonconductive layer (or a part of) the tape. The electrical pads of an integrated circuit are bonded to the respective leads of the tape simultaneously. The leads are cut at a predetermined length from the chip and outside of the frame. The lead ends are bent to form a nest. A planar ba is adehered to the surface of the chip having the electrical pads. The leads are then bent over the ba to cure the ba on the tape and provide electrical contact points to the chip. The chip is coated with a suitable material and to provide insulation and encapsulation of the entire packaging structure. At a desired time, the complete chip packaging structure may be removed from the tape by cutting the frame.
汤圆简笔画图片
申请人:VTC INCORPORATED
安环部>微观世界纪录片代理机构:Kinney & Lange
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