专利名称：WAFER MOLDING FOR CHIP-ON-WAFER ASSEMBLY
肉炒莴笋发明人：KELLY, Michael G.,HINER, David
Jon,HUEMOELLER, Ronald Patrick学计算机的学校
申请号：US2013/068540
申请日：20131105
叉烧是什么肉做的
公开号：WO2014/078133A1
公开日：
怎样快速治咳嗽
20140522
专利内容由知识产权出版社提供
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专利附图：
摘要：Methods for temporary wafer molding for chip-on-wafer asmbly may include bonding one or more miconductor die to an interpor wafer, applying a temporary
mold material to encapsulate the bonded die, and backside processing the interpor, which may be singulated to generate asmblies comprising the bonded die, the interpor die, which may be bonded to packaging substrates. The temporary mold material may be removed and the bonded die may be tested. Additional die may be bonded to the asmblies bad on the electrical testing. The interpor may be singulated utilizing one or more of: a lar cutting process, reactive ion etching, a sawing technique, and a plasma etching process. The backside processing may compri thinning the interpor wafer to expo through-silicon-vias (TSVs) and placing metal contacts on the expod TSVs. The die may be bonded to the interpor utilizing a mass reflow or thermal compression process.怎么修改图片
申请人：AMKOR TECHNOLOGY, INC.
地址：85286 US
国籍：US
瑜伽怎么学代理人：MICHEL, Erick J.
漫花之舞
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