专利名称：Wafer to Wafer Bonding Process and
Structures
发明人：Chen-Hua Yu,Ming-Fa Chen,Wen-Ching Tsai个人先进材料怎么写
申请号：US14712729
申请日：20150514
颜体书法作品欣赏公开号：US20160190089A1
公开日：
20160630酸汤黄骨鱼
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专利内容由知识产权出版社提供
专利附图：
摘要：Bonded structures and method of forming the same are provided. A conductive layer is formed on a first surface of a bonded structure, the bonded structure including a first substrate bonded to a cond substrate, the first surface of the bonded structure
being an expod surface of the first substrate. A patterned mask having first openings and cond openings is formed on the conductive layer, the first openings and the cond openings exposing portions of the conductive layer. First portions of first bonding connectors are formed in the first openings and first portions of cond bonding connectors are formed in the cond openings. The conductive layer is patterned to form cond portions of the first bonding connectors and cond portions of the cond bonding connectors. The bonded structure is bonded to a third substrate using the first bonding connectors and the cond bonding connectors.自作多情的句子
巨蟹和双鱼
申请人：Taiwan Semiconductor Manufacturing Company, Ltd.最后的天朝
泰坦尼克英文地址：Hsin-Chu TW
国籍：TW
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