Method for low temperature bonding and bonded stru

更新时间:2023-05-14 06:10:57 阅读: 评论:0

有鬼哥专利名称:Method for low temperature bonding and
bonded structure
发明人:Qin-Yi Tong,Gaius Gillman Fountain,Paul M.
Enquist
申请号:US11980664
申请日:20071031
公开号:US20080053959A1
公开日:
20080306
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摘要:A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. One etching process The method may also include removing by-products of interface polymerization to prevent a rever
polymerization reaction to allow room temperature chemical bonding of materials such as silicon, silicon nitride and SiO. The surfaces to be bonded are polished to a high degree of smoothness and planarity. VSE may u reactive ion etching or wet etching to slightly etch the surfaces being bonded. The surface roughness and planarity are not degraded
and may be enhanced by the VSE process. The etched surfaces may be rind in solutions such as ammonium hydroxide or ammonium fluoride to promote the formation of desired bonding species on the surfaces.
杨姓女孩取名申请人:Qin-Yi Tong,Gaius Gillman Fountain,Paul M. Enquist
手工风车怎么做地址:Durham NC US,Youngsville NC US,Cary NC US
违反唯一约束条件>中年人微信名国籍:US,US,US
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