Designation:D2739−97(Reapproved2010)
Standard Test Method for
Volume Resistivity of Conductive Adhesives1
This standard is issued under thefixed designation D2739;the number immediately following the designation indicates the year of original adoption or,in the ca of revision,the year of last revision.A number in parenthes indicates the year of last reapproval.A superscript epsilon(´)indicates an editorial change since the last revision or reapproval.
1.Scope
1.1This test method covers the determination of the volume resistivity of resin-bad conductive adhesives in the cured condition.The test is made on a thin adhesive layer as prepared in a bonded specimen.This test method is ud for conductive adhesives that are cured either at room temperature or at elevated temperatures.
1.2The values stated in either SI or other units shall be regarded parately as standard.SI equivalents to screw threads are shown in thefigures.
1.3This standard does not purport to address the safety concerns,if any,associated with its u.It is the responsibility of the ur of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to u.
2.Referenced Documents
2.1ASTM Standards:2
D618Practice for Conditioning Plastics for Testing
D907Terminology of Adhesives
2.2Federal Specification:
QQ-B-626Composition223
2.3ASTM Adjuncts:
Asmbly Jig4
3.Terminology
3.1Definitions:
3.1.1Many terms in this test method are defined in Termi-nology D907.
3.1.2conductivity,n—the ratio of the current density carried through a specimen to the potential gradient paralleling the current.This is numerically equal to the conductance between opposite faces of a unit cube of liquid.It is the reciprocal of resistivity.D2864,D27 3.1.3resistivity,volume,n—the ratio of the electric potential gradient to the current density when the gradient is parallel to the current in the material.D1566,D11
4.Summary of Test Method
4.1The volume resistivity of adhesive layers cured between metal adherends is measured on a resistance bridge.Tensile adhesion plugs(Fig.1)5are described in this test method.Any other test specimens and materials can be ud as long as similar precautions(e Section7)are obrved regarding preparation and tolerances.
5.Significance and U
5.1Accurate measurement of the volume resistivity of conductive adhesives is important,particularly with respect to applications in electronic packaging techniques.This method measures the resistance of conductive adhesives ud in thin films as part of a bonded asmbly.This does not imply that the measured results are applicable to different configurations with different metals.This method may be ud for acceptance testing and for screening materials.
6.Apparatus
6.1Kelvin(Resistance)Bridge,calibrated to1%accuracy.6 6.2With the agreement of the interested parties,any metal tensile adhesion plugs(Fig.1)can be ud to prepare the tensile adhesion specimens.
N OTE1—Different metals will inherently provide different resistance values.The measured resistance is dependent on resistance at the adhesive-adherend interface due to metal oxide formation.The extent of oxide formation varies with locality and laboratory conditions.Brass, conforming to Federal Specification QQ-B-626Composition22,is a convenient metal.However,in order to minimize oxide formation,
1This test method is under the jurisdiction of ASTM Committee D14on Adhesives and is the direct responsibility of Subcommittee D14.80on Metal Bonding Adhesives.
Current edition approved Oct.1,2010.Published October2010.Originally approved in1968.Last previous edition approved in2004as D2739–97(2004). DOI:10.1520/D2739-97R10.
2For referenced ASTM standards,visit the ASTM website,,or contact ASTM Customer Service at For Annual Book of ASTM Standards volume information,refer to the standard’s Document Summary page on the ASTM website.
3Available from Standardization Documents Order Desk,DODSSP,Bldg.4, Section D,700Robbins Ave.,Philadelphia,PA19111-5098, dodssp.daps.dla.mil.
4Detailed drawings of the asmbly jig are available from ASTM International Headquarters.Order Adjunct No.ADJD2739.Original adjunct produced in1987.
5Plugs to accommodate banana plug—No.192,Herman H.Smith,Inc.,or equivalent.
6Satisfactory resistance bridges are made by:Leads and Northup Co.Bridge Catalog No.4306,Minneapolis Honeywell Division Catalog No.1622,and Biddle Instruments Catalog No.603282.
Copyright©ASTM International,100Barr Harbor Drive,PO Box C700,West Conshohocken,PA19428-2959.United States --` ` ` , , ` , ` ` , , ` , , ` , , , ` ` , ` ` ` , , , , , ` -` -` , , ` , , ` , ` , , ` ---
especially where measurements are critical,as in referee measurements,it is recommended that the metal plugs be plated with either gold or silver to a thickness of not less than 1µm (0.000040in.).Any size plug up to 30mm in diameter can be ud with the aid of an alignment jig.4
7.Test Specimen
7.1Thoroughly abrade the face of the specimen to be bonded (other than gold-or silver-plated)with crocus cloth 4527or equivalent,and wipe with clean solvent,such as reagent-grade methyl ethyl keto
ne,immediately prior to bond-ing.
7.2Mix the adhesive to be tested in accordance with the manufacturer’s instructions,taking care to mix in as little air as possible.
7.3Coat sufficient adhesive on the surface to be bonded to ensure uniform squeeze-out around the edge of the bonded area.Remove excess adhesive,controlling the bond thickness as shown on an asmbly jig.4
7.4Prepare five specimens each for the following two thickness:(1)0.1360.02mm,and (2)0.5160.01mm.7.5Cure the adhesives in accordance with the manufactur-er’s instructions.Curing under other conditions of time and temperature is acceptable by an agreement of the interested parties.
8.Preparation of Apparatus
8.1Before application of the adhesive,t the adhesive thickness by tightening plugs in place,using a feeler gauge to determine the clearance between plugs.
8.2Bottom out the top plate on the guide post before and after application of the adhesive.
8.3After the adhesive has been cured,remove or loon (at a temperature clo to the highest temperature of cure)any remaining shims,screws,or devices of this nature,so that the adhesive layer cools in an unrestrained condition.9.Conditioning
9.1Condition the cured test specimens at 2361°C (73.461.8°F)and 5065%relative humidity for at least 88h prior to the test.
9.2Test at the conditions specified in 8.1above.
9.3If conditions other than tho given herein are needed,it is suggested that they be lected from tho given in Practice D618.10.Procedure
10.1Make contacts (banana-plug type)so that when the specimen is in the measuring circuit,the potential leads are inside the current leads (for example,potential lead connec-tions are clor to the adhesive bond)(Fig.1).Make the measurements with the specimen in a stress-free position,since mirigid and flexible formulations are very nsitive to stress change during measurements.
10.2Measure and record the resistance.8
N OTE 2—If the resistance value of the adhesive layer is greater than 10−4
Ω,the resistance of the plugs can be ignored and the total resistance taken as the resistance of the adhesive layer.The resistivity of copper,silver,and brass are listed for comparison.9
7
Crocus cloth 452is available from the Carborundum Co.,Niagara Falls,NY .
8
A general description of the Kelvin resistance bridge is found in Stout,M.B.,Basic Electrical Measurements ,Par.4.21to 4.26,Prentice Hall,Inc.,April,1961.9
American Institute of Physics Handbook ,Second Edition,Gray,E.H.,Ph.D.,ed.,
1957.
FIG.1Brass Tensile Adhesion Specimens with Electrical
Connections
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Metal Volume Resistivity at Temperature
Copper 1.729×10−6Ω·cm at 20°C Silver 1.629×10−6Ω·cm at 20°C Brass
3.65×10−6Ω·cm at 0°C
11.Calculation
11.1Calculate the volume resistivity of the test specimen as follows:
V 5R 0A /L
(1)
where:
V =volume resistivity,Ω·m,
R 0=obrved resistance of the test specimen,Ω(as mea-sured with the bridge),corrected for any error found in the calibration of the bridge,including the resistance metallic plugs cleaned as specified in Section 7,
A =cross-ctional area of the test specimen,m 2,and L =thickness of adhesive layer,m.12.Report
12.1Report the following information:
12.1.1Complete identification of the adherend and adhesive materials tested,including adhesive type,source,and manu-facturer’s code number,
12.1.2Curing conditions ud,
12.1.3Conditioning environment and test environment,12.1.4Number of specimens tested per sample,
12.1.5Dimensions of each test specimen including adhesive line thickness,
12.1.6Corrected resistances of each test specimen,
12.1.7V olume resistivity,in ohm-centimeters,of each test specimen,
12.1.8Average volume resistivity of the sample,when more than one test specimen per sample is ud,and
12.1.9Standard deviation of the volume resistivity mea-surements when more than one test specimen per sample is ud.
13.Precision and Bias
13.1Precision and bias have not been determined for this test method.14.Keywords
14.1adhesive;conductive adhesive;conductivity;resistiv-ity;volume resistivity
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