专利名称：Plating jig, plating apparatus and plating method
发明人：寺下 光彦，中村 孝司，川脇 拓哉，中村 綾佑，北條 将史，松村 宗順
申请号：JP2017105215
申请日：20170529
公开号：JP6367427B1
公开日：
20180801
专利内容由知识产权出版社提供
摘要： To positively hold a work to be plated on a plating jig, to easily attach and detach a plating object to and from a plating jig, suspend the object to be plated without swinging, hold the plated object To a plating jig, a plating apparatus and a plating method capable of preventing a mark of a plating jig from remaining on a plate surface of an object.SOLUTION: This apparatus compris a support portion 1 for suspending and supporting an object to be plated B1 in a plating tank, an upper surface 31a which is connected to the lower end side of the support portion 1 at the longitudinal direction intermediate portion and places the magnetic force provision portion 21, A holding portion 31 having a linear thickness and having a lower end side 31b corresponding to the shape of the outer peripheral end portion B1a of the workpiece B1 to be plated, a plurality of permanent magnets 2a arranged on the upper side of the holding portion 31 A plating process is performed by using a plating apparatus in which a plating jig A 1 provided with a magnetic force providing ction 21 in which the magnetic pole directions in the vertical direction are arranged on the upper surface 31 a of the holding ction 31 in the plating tank .BACKGROUND OF THE INVENTION
申请人：帝国イオン株式会社
地址：大阪府東大阪市柏田西１丁目１２番２６号国籍：JP
代理人：西川 裕子
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