专利名称：PEELING FILM
工程项目管理流程发明人：FUKAYA TOMOMI，深谷 知巳美味牛肝菌
申请号：JP2017144976
申请日：20170726
学雷锋树新风公开号：JP2019029423A重庆的变化
公开日：
20190221
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摘要：To provide a peeling film which is superior in peelability from a mold and a aled body, which
hardly form wrinkles when held by and between the molds, which enables the suppression of pollution on the mold by a low-molecular weight
component.SOLUTION: A peeling film 10 is to be ud in manufacturing a miconductor package 70 by mold aling. The peeling film 10 compris: a ba material 1; a peeling agent layer 2; and a resin layer 3. The size change rate of the peeling film 10 is less than创卫标语
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2.5% in both a lengthwi direction and widthwi direction. The ba material 1 has a tensile elasticity of 150 MPa or more and 350 MPa or less. In the peeling film 10, the peeling agent layer 2 is formed from a peeling agent composition including a
multifunction amino compound and a peeling component. The resin layer 3 is formed
from a composition for forming a resin layer, which includes an epoxy compound, a polyester resin and a multifunction amino compound. The arithmetic mean roughness Ra of a side face of the resin layer 3 of the peeling film 10 is 100 nm or more and 1200 nm or less.SELECTED DRAWING: Figure 1
申请人：LINTEC CORP,リンテック株式会社
地址：東京都板橋区本町２３番２３号
国籍：JP
代理人：早川 裕司，村雨 圭介，飯田 理啓
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