PCB Printed Circuit Board
素描基础教学A1.Process 流程 Board Cut 开料 → Drill钻孔 → Incoming Quality Control (IQC) →英语作文句式 Plated Through Hole (PTH) →Panel Plating 整板镀铜 → dry film 干膜 →pattern plating 图形电镀→Flash Gold Plating 闪金电镀 Cu(Copper)/Sn(Tin) Plating → etch 蚀刻 → quality control (FIRST)QC → Wet film W/F → Legend ( Mark Printing , Component Mark)文字 → Hot Air Leveling 喷锡 ( Immersion Gold, Chemical Gold 沉金 ) → Routing 锣板 (Punching啤板) → V-Cut → Rin 洗板 → E-test → Entek → Final Quality Control FQC → QA Audit 审核 → Package → Shipment ( Delivery) 出货
B drill process 钻孔工序 the type of holes 社区趣味运动会孔的类型 Via hole 通孔 Component hole 元件孔 Installing hole 安装孔 Registration hole (for Printing ,HAL ,Chemical gold etc) 定位孔 Slot 槽孔 PTH hole 电镀孔 NPTH hole 非电镀孔 Big hole(Too big to tent 孔太大,不能掩孔) Small hole 小孔
1. Drill process Board cut 开料 → Pin hole making 销钉孔(Registration pin ) → Board up 上板 → Drilling → 无月Board down → Check 检查
2. Parameters 参数 Drill Bit 钻咀 Diameter of hole (drill bit)孔径 Feed speed 进刀速度 RPM (Round per minute ) 转速 How many panels (Total thickness 厚度) 上板数量 Hole quantity 孔数
3.Quality 品质 about drill bit 关于钻咀 chips 缺口 overlap 重合 gap 间隙 flair变形 about hole 关于孔 rough (roughness) 粗糙度 burrs (deburr) 去毛刺 nailheading 钉头 (multilayer多层板) resin smear (desmear)除胶渣 surface scratch 表面擦花 breakout of registration hole 定位孔爆 hole shift 偏孔(位) hole plugged堵孔 raw material 材料 Laminate 板材 copper foil 铜箔 prepreg 半固化片
周报范文30篇C Main contents IQC （ IQC主要内容） 企业生命周期理论Measuring tooling 测量工具 Pin gauge 针规 Caliper 卡尺 C-caliper 螺旋卡尺 X-ray instrument for Au/Ni thickness X光金/镍测厚仪 Outline Artwork for outline dimension 外形菲林 Visual check 肉眼检查 2. The main raw materials 主要材料 laminate 板材 prepreg半固化片 copper foil铜箔 chemical 化学药品 dry film wet film Pb(lead)/Sn(Tin) Alloy mixture of metals 铅锡合金 flux 松香 etch salt 蚀板盐 carbon ink 碳油 legend ink字符油墨 die 模具 Semifinished pro
ducts form sub-contractor 外协厂 3.Quality of laminate 板材品质 Pin hole 针孔 dent 凹痕 scratch 擦花 delamination 分层 white spot 白点 fibre exposure 露纤维 discolour 变色 thickness deviation 厚度偏差 surface oxidation 表面氧化
D PTH Process Deburr 除胶渣→ Degrea 除油脂 → Rin (C.I Water) → Microetch 微蚀 → Rin →Dip In Sulfate Acid Solution 酸洗 → Rin → Pre-Dip 预浸 → Catalyst 崔化剂→ Rin → Accelerate 加速剂 →Rin → PTH → Rin → Dry烘干
E Several Concepts Electroless Plating (Electroplating) 无电镀铜 Dummy Plating 拖缸 APS (Ammonium Per Sulfate) 过硫酸铵 Deionized Water 去离子水 C.I Water 自来水 Loading 负载 Deposition Rate 沉铜速率 Foam 泡沫 Heater 加热器 Pink Ring 粉红圈 (红环) Clot 结块 Hard Water 硬水 Soft Water 软水 Debris 树脂屑 Rough Copper Deposit 沉铜粗糙 Peel Off 铜层剥离 Void 空洞 Poor Adhesion 结合力不良 Short Bath Life 槽液短命 Poor Backlight 背光不良 No Copper Deposit On Hole Wall 黑孔
F D/F process Scrub 磨板 → Laminate 贴膜 → Artwork check 菲林检查 → Image transfer 对位 →
expo 曝光 → develop 显影 → touchup 执漏
Main materials 主要材料 dry film sodium carbonate 碳酸钠 defoam 除泡剂 alcohol 洒精 yellow film黄菲林
Main machines 主要设备 Laminator 贴膜机 exposure machine 曝光机 developing machine 显影机 developing machine for yellow artwork 黄菲林显影机 (重氮显影机)
特别好看的手机壁纸Quality Open/short bur chip under-develop 显影不够 overdevelop 显影过度 underexposure 曝光不够 overexposure 曝光过度 scratch surface contamination 表面污染 bubble 气泡
Main parameters参数 break point 突破点 footprint 磨痕 exposure index 曝光指数 stauffer 曝光尺(光楔表)
G Sn(Tin)-plating degrea 除油污→ rin → microetch 微蚀→ rin → dip in sulfate acid solution 酸洗→ Cu(copper)-plating 电铜 → rin → Tin-plating 镀锡
Main materials Copper sulfate 硫酸铜 copper ball 铜球 Acid sulfate 硫酸 Tin metal bar 锡条 Stannous sulfate硫酸亚锡 Additives 添加剂 brightener 光亮剂
The other uful words Make-up 开缸 make-up procedure 开缸程序 Anode 阳极 Cathode 阴极 maintenance 维护\保养 litre 升 gram 克 volume 容积 carbon treat 碳处理 Current Density 电流密度Current Area 电流面积
Quality corner crack 角部断裂 pit 凹痕(麻点,大凹痕为dent幼儿园成长档案) Non-uniform 不均匀 dull plating 镀层发暗 poor adhesion 结合力不良 void 空洞 copper thickness under spec. 铜厚不符合要求(标准)
Etch process strip 去膜 → etch → tin-strip → QC(quality check)
Etching line 蚀刻线 etch salt 蚀板盐 ammonia 氨水(ammonium 铵) copper chloride 氯化铜 tin-strip chemical退锡水 poor strip 退膜不良 poor tin-strip 退锡不良（净） poor etch 蚀刻不良 over-etch 蚀刻过度 open/short black hole 黑孔 void 空洞 scratch 刮花 chip 缺口 bur 毛刺 peel off 剥离 etch factor 蚀刻因子 tin-transfer 锡迁移 undercut 侧蚀 line width 线宽 line space 线距
W/F process scrub 磨板 (pumice 火山灰 or chemical treatment 化学处理 ) → screen printing 丝印 → pre-cure 前焗 → expo → develop → postcure 后焗 → touch up
Scrubber (scrub machine) printing machine 丝印机 exposing machine developing machine
Pumice火山灰chemical diazo film 重氮片 wet film sodium carbonate poor developing scratch peel off S(solder)/M(mask) in hole 绿油入孔 S/M on pad 绿油上焊盘 S/M on gold finger 绿油上金手指 S/M on mark overdevelop 显影过度 residue 垃圾，杂物(particals 颗粒) copper exposure 露铜 stauffer test 曝光尺实验 adhesion 粘度 stencil 网板 footprint 磨痕 breakpoint 突破点，显影点
