专利名称：Pin-fin heat sink
发明人：Brady, Kevin James,Cohn, Charles
销售分享申请号：EP94304526.0
申请日：19940622木梳子
公开号：EP0632498A1
公开日：
19950104了如指掌
儿童的时间
专利内容由知识产权出版社提供
专利附图：
摘要：A houd integrated circuit unit package is provided with a heat sink for removal and dissipation of heat from electronic circuits houd in packages. The heat sink,学校消防安全制度
mounted on an outer surface of the package, includes a plurality of pins cured at one end with a retainer and flared out at the other end into a starburst or bouquet
configuration, the pins being in the form of rods lected from solid cylinders and tubes. The bottom of the retainer-bound end is coated with a curing substance, such as solder or a heat-conducting adhesive, which is planarized to facilitate positioning of the heat sink on the package. The heat sink is cured to the package by means of solder or a heat-conducting adhesive. The heat sink is produced by curing a plurality of elongated rods by retainers placed at intervals corresponding to a height of the heat sink, cutting off said rods adjacent to one side of the retainer, and flaring the rods at the other free end of the cut-off rods into a starburst-like configuration. The retained ends of the rods are dipped into a solder or heat-conducting adhesive and planarized to provide a planar surface for mounting the heat sink on the surface of the package.大肠面
申请人：AT&T Corp.
地址：32 Avenue of the Americas New York, NY 10013-2412 US
国籍：US
代理机构：Johnston, Kenneth Graham
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