专利名称：METHOD OF CONDUCTING
很困怎么办
PRECONDITIONED RELIABILITY TEST OF高业绩
SEMICONDUCTOR PACKAGE USING
关于父爱的事例
CONVECTION AND 3-D IMAGING
发明人：Hye-Kyong Oh,Ho-Jeong Moon
申请号：US12686496
申请日：20100113
公开号：US20100177165A1
公开日：
20100715
有一个地方
专利内容由知识产权出版社提供
赏月英文
专利附图：恋爱说说
摘要：A precondition reliability test of a miconductor package, to determine a
propensity of the package to delaminate, includes a baking test of drying the package, a moisture soaking test of moisturizing the dried package, a reflow test of heat-treating the moisturized package using hot air convection, and a three-dimensional imaging of the package to acquire a 3-D image of a surface of the package. The three-dimensional imaging is preferably carried out using a Moire interferometry technique during the cour of the reflow test. Therefore, the delamination of the package can be obrved in real time so that data on the start and rapid development of the delamination can be produced. The method also allows data which can be ordered as a Weibull Plot to be produced, thereby enabling a quantitative analysis of the reliability test results.
申请人：Hye-Kyong Oh,Ho-Jeong Moon
地址：Hwasung-City KR,Hwasung-City KR
国籍：KR,KR
生三七粉更多信息请下载全文后查看
>建筑设计竞赛
