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Customer Information
Customer :
Part Name :
Part No. :
Model No. :
协议拆迁COMPANY PURCHASE R&D
Vendor Information
Name: RS INDUSTRY LIMITED
Part Name Chip ESD
Part No. RS 0402-12V0R8S
倍的认识
RS060306T
Lot No.
1.1 Technology Data
Symbol Value Unit Maximum allowable continuous AC voltage at 50-60Hz V RMS 8V Maximum allowable continuous DC voltage V DC
12V
ESD voltage measured
Vv 70~100V
Typical capacitance value measured at 1MHz C 0.8~1.5pF Typical capacitance value tolerance +80 -20% Maximum ESD allowable clamping Voltage ＊2V CLAMP ≦
150V
Leakage current at V DC ＊3 (At initial state) I LDC < 0.1 uA Leakage current at V DC ＊3 (After E
SD Test)
I LDCA < 2 uA 1.2 Reference Data
Respon time
障碍的反义词T ri < 1 ns Operatiog ambient temperature -50～ +85 ℃ Storage temperature
-50～+125 ℃ ESD testing
IEC61000-4-2 level 4 1.3 Other Data
Body ZnO
End termination
Ag/Ni/Sn
Packaging Reel Complies with Standard IEC61000-4-2
Lead Content < 1000 ppm Marking
None
Notes ：
＊ 1 The ESD voltage was measured at 1 mA current
＊ 2 The Clamping voltage was measured at 8*20 us standard current. ＊ 3 The Leakage current was measured at working voltage. ＊ 4 The Energy only for customer reference.
＊ 5 The components shall be employed within 1 year, in the nitrogen condition.
PART NO. RS 0402-12V0R8S前景行业
5680
60 0.6PART NO. RS060306T
上午英语
2 .Size
Model0402(1005) 0603(1608)0805(2012)1210(3225)1812(4532)
1206(3216)2220(5750)
Length(L) 1.00 ±0.10 1.60±0.15 2.00±0.20 3.20±0.20 3.20±0.20 4.50±0.20 5.70±0.20
Width(W)0.50 ±0.100.80±0.10 1.25±0.15 1.60±0.15 2.50±0.20 3.20±0.20 5.00±0.20
Thickness(T)0.60 max0.90 max 1.20 max 1.50 max 1.50 max 2.00 max 2.50 max
Termination(a) 0.25±0.1 0.3±0.1 0.3±0.1 0.5±0.2 0.5±0.2
3. ESD Wave Form
0.5+0.3/-0.1 0.5+0.3/-0.1
IEC61000-4-2 Standards
SEVERITY LEVEL AIRDIRCHARGE
DIRECT
DISCHARGE
4. Environment Reliability Test
Characteristic Test method and description
High Temperature
Storage
The specimen shall be subjected to 125 ± 2℃for 1000 ± 12 hours in a thermostatic
bath without load and then stored at room temperature and normal humidity for 1 to
2 hours. The change of varistor voltage shall be within 10 ﹪.
公关媒介Step Temperature Period
1 -40±3℃ 30Min±3
2 Room
Temperature 1
hour
3 125±3℃ 30Min±3
Temperature Cycle
The temperature cycle of specified
temperature shall be repeated five times
and then stored at room temperature and
normal humidity for one or two hours. The
change of varistor voltage shall be within 10
﹪and mechanical damage shall be
examined. 4 Room
Temperature 1
hour
High Temperature
Load
After being continuously applied the maximum allowable voltage at 85 ± 2℃ for
1000± 2 hours, the specimen shall be stored at room temperature and normal
humidity for one or two hours, the change of varistor voltage shall be within 10﹪.
Damp Heat Load/
Humidity Load
The specimen should be subjected to 40 ± 2℃, 90 to 95 ﹪RH environment, and the
maximum allowable voltage applied for 1000 hours, then stored at room temperature
and normal humidity for one or two hours. The change of varistor voltage shall be
within 10﹪
Low Temperature
Storage
The specimen should be subjected to -40 ± 2℃, without load for 500 hours and then
stored at room temperature for one or two hours. The change of varistor voltage shall
be within 10 ﹪
1 2 KV 2 KV
2 4 KV 4 KV
3 8 KV 6 KV
4 1
5 KV8 KV
IEC 61000-4-2 Compliant ESD Current Pul Waveform
5. Soldering Recommendations 5.1 Recommended solder pad layout
（Unit ：mm ）
A
B
C
D
0402 0.4~0.6 1.4~1.8 0.5~0.6 0.6~1.2
0603 0.9~1.2 2.7~3.2 0.7~1.0 0.9~1.2
0805 1.0~1.5 2.6~3.2 1.2~1.5 1.1~1.81206 1.8~2.5 4.2~5.2 1.2~1.8 1.2~1.81210 1.8~2.5 4.2~5.2 2.2~3.0 1.3~2.0
1812 2.5~3.3 5.5~6.7 2.8~3.6 1.3~2.2
2220 3.8~4.6 6.6~7.8 4.8~5.5 1.3~2.2
5.2 The SIR test of the solder paste shall be done 5.3 Steel plate and foot distance printing Foot distance printing (mm)
Steel Plate thickness (mm)
> 0.65mm
0.18mm
红烧鱼
0.65mm~0.5mm 0.15mm 0.50mm~0.40mm 0.12mm >=0.40 mm
0.10mm
5.4The IR reflow and temperature of Soldering for Pb Free
☆ IR reflow Pb Free Process suggestion profile
(1) The solder recommend is Sn96.5/Ag 3.5 of 120 to 150μm
(2) Ramp-up rate (217℃ to Peak) + 3℃/cond max (3) Temp. maintain at 175 +/-25℃ 180 conds max (4) Temp. maintain above 217 ℃ 60-150 conds
(5) Peak temperature range 245℃ +20℃/ -10 ℃ time within 5 ℃ of actually peak temperature (tp) 10~20 conds
(6) Ramp down rate +6 ℃/cond max.
5.5 Resistance to soldering heat-High Temperature Resistance:260℃,10c-3times.
5.6 Hand Soldering
In hand soldering of the Varistors. Large temperature gradient between preheated the Varistors and the tip of soldering iron may cau electrical failures and mechanical damages such as
crackings or breakings of the devices. The soldering shall be carefully controlled and carried out so that the temperature gradient is kept minimum with following recommended conditions for hand soldering.
5.6.1 Recommended Soldering Condition 1
（1） Solder ：
0.12~0.18mm Thread solder (Sn96.5:Ag3.5) with soldering flux in the core. Rosin-bad and non-activated flux is recommended. （2） Preheating
The Varistors shall be preheated so that Temperature Gradient between the devices and the tip of soldering iron is 150℃ or below. （3）Soldering Iron
Rated Power of 20w max with 3mm soldering tip in diameter.
Temperature of soldering iron tip 380℃max,3-5c ( The required amount of solder shall be melted in advance on the soldering tip.) （4）Cooling
After soldering. The Varistors shall be cooled gradually at room ambient temperature.
5.6.2 Recommended Soldering Condition 2（Without preheating ）
（1）Solder iron tip shall not directly touch to ceramic dielectrics.
（2）Solder iron tip shall be fully preheated before soldering while soldering iron tip to the external electrode of Varistors.
5.7 Post Soldering Cleaning
5.7.1 Residues of corrosive soldering fluxes on the PC board after cleaning may greatly have
influences on the electrical characteristic and the reliability (such as humidity resistance)of the Varistors which have been mounted on the board. It shall be confirmed that the characteristic and the reliability of the devices are not affected by the applied cleaning conditions.
5.7.2. When an ultrasonic cleaning is applied to the mounted Varistors on PC Boards. Following
conditions are recommended for preventing failures or damages of the devices due to the large vibration energy and the resonance caud by the ultrasonic waves. （1）Frequency 29MHz max
美女泳装照（2）Radiated Power 20w/lithr max （3）Period 5minuets max
※
Perform adequate test in advance as the reflow temperature profile will vary according to the conditions of the manufacturing process, and the specification of the reflow furnace. RS INDU STRY LIMITED
RS Chip Single ESD Suppressor
