缺陷分类——精选推荐

更新时间:2023-07-30 21:23:44 阅读: 评论:0

缺陷分类
1.线弧上的缺陷:Damaged wire (⾦丝损伤) sagging wire (塌丝) Tight wire (绷线) cross wire(线交叉) 1.线弧上的缺陷:Damaged wire (⾦丝损伤) sagging wire (塌丝) Tight wire (绷线) cross wire(线交叉) Gap<2mil(线隙<2mil)loop too high (线弧⾼) Re-bonding (重复连接错误) missing wire(漏线) Gap<2mil(线隙<2mil) loop too high (线弧⾼) Re-bonding (重复连接错误) missing wire(漏线)
broking wire (引线断裂)NSOP(压点上未焊牢) wire debris(碎线) wire short (引线短路) broking wire (引线断
裂)NSOP(压点上未焊牢) wire debris(碎线) wire short (引线短路)
2.线和球交接处的缺陷:broking wire(引线断裂)颈部受损 bond tail (键压点拖尾) 2.线和球交接处的缺陷:broking
wire(引线断裂)颈部受损 bond tail (键压点拖尾)
3.球和芯⽚上⾯的缺陷:ball size too big or too small(球太⼤或太⼩) off center bond(偏离压点中⼼) 3.球和芯⽚上⾯的缺陷:ball size too big or too small(球太⼤或太⼩) off center bond(偏离压点中⼼)
Stitch bond size too big or too small(焊点尺⼨太⼤或太⼩)Lift ball(浮起第⼀焊点)Stitch bond size too big or too small(焊点尺⼨太⼤或太⼩)Lift ball(浮起第⼀焊点)
Ball thickness too big or too small(球厚度太⼤或太⼩) wrong bond (错误键压)Ball thickness too big or too small(球厚度太⼤或太⼩) wrong bond (错误键压)
Golf ball bond(⾼尔夫球状⾦线键压)Bond too scribe(键压到轮廓线)no bond (⽆键合Golf ball bond(⾼尔夫球状⾦线键压)Bond too scribe(键压到轮廓线)no bond (⽆键合
Pad cratering(弹坑) Smash bond (粉碎型键合) Wire Debris(碎线)⾦球外溢Pad cratering(弹坑) Smash bond (粉碎型键合) Wire Debris(碎线)⾦球外溢
Partially lifted stitch(部分浮起焊点)Lift stitch(浮起焊点) CAP 印(劈⼑印)Partially lifted stitch(部分浮起焊点)Lift stitch(浮起焊点) CAP 印(劈⼑印)
Tail length(线尾长度)Wire avulsion quality(铝线撕扯质量)焊点错位Tail length(线尾长度)Wire avulsion quality(铝线撕扯质量)焊点错位
Lifted metal (peeling)(⾦属层提拉) Wedge size(焊点尺⼨)Lifted metal (peeling)(⾦属层提拉) Wedge size(焊点尺⼨)4.芯⽚上的缺陷: Ink die(墨点芯⽚ edge die(边缘芯⽚) Die location/Ro碍怎么组词
tation(芯⽚位置/旋转) 4.芯⽚上的缺陷: Ink die(墨点芯⽚ edge die(边缘芯⽚) Die location/Rotation(芯⽚位置/旋转)
crack(开裂) epoxy/solder on die (芯⽚上有银浆)scratch(划伤)Contam on die(芯⽚沾污)crack(开裂) epoxy/solder on die (芯⽚上有银浆)scratch(划伤)Contam on die(芯⽚沾污)
Die tilt(芯⽚倾斜) stack die(芯⽚重叠) missing die (漏芯⽚)die displacement(芯⽚错位) Die tilt(芯⽚倾斜) stack die(芯⽚重叠) missing die (漏芯⽚)die displacement(芯⽚错位)
NG die(不良芯⽚) collet mark on die 吸嘴压伤 Overturned die(芯⽚翻转)NG die(不良芯⽚) collet mark on die 吸嘴压伤Overturned die(芯⽚翻转)
Foreigh Material on Die(芯⽚上有异物) wrong die orientation(芯⽚⽅向)Foreigh Material on Die(芯⽚上有异物) wrong die orientation(芯⽚⽅向)
misalign saw(切割偏位)void die(压点缺损) 铝层卷起⼩⽿朵 chip(缺⾓)misalign saw(切割偏位)void die(压点缺损) 铝层卷起⼩⽿朵 chip(缺⾓)
5.芯⽚与PAD交接处的缺陷:epoxy fillet height(侧⾯银浆⾼度)epoxy/solder void(环氧树脂⽓孔) 5.芯⽚与PAD交接处的缺陷:epoxy fillet height(侧⾯银浆⾼度)epoxy/solder void(环氧树脂⽓孔)
Epoxy/solder coverage(银浆覆盖⾯积) ⽩板 die chip Epoxy/solder coverage(银浆覆盖⾯积) ⽩板 die chip七年级下册英语作文
6.第⼆焊点与lead的缺陷:NSOL edge bond(键压到边缘)虚焊 6.第⼆焊点与lead的缺陷:NSOL edge bond(键压到边缘)虚焊
白灼海螺第⼆焊点隐裂第⼆焊点卷起鱼尾不良 Overlap bond on lead(管脚重叠键合)第⼆焊点隐裂第⼆焊点卷起鱼尾不良 Overlap bond on lead(管脚重叠键合)
7.框架上的缺陷:epoxy on l/f(在L/F上有银浆) Lead frame Discoloration(引线框架氧化)7.框架上的缺陷:epoxy on l/f(在L/F 上有银浆) Lead frame Discoloration(引线框架氧化)
Bent Tie Bar(Tie Bar 弯折))Lead Short(引脚短路)Tilt or twist:(翘曲或者扭曲)Bent Tie Bar(Tie Bar 弯折))Lead Short(引脚短路)Tilt or twist:(翘曲或者扭曲)
PAD上翘/下陷 Passivation defects((钝化层缺陷 ) 框架变形镀银层不全PAD上翘/下陷 Passivation defects((钝化层缺陷 ) 框架变形镀银层不全
Discolored DAP back:(DAP 背⾯变⾊)Bent Frame(引线框架弯折受损)Discolored DAP back:(DAP 背⾯变⾊)Bent Frame(引线框架弯折受损)
1.线弧上的缺陷:Damaged wire (⾦丝损伤) sagging wire (塌丝) Tight wire (绷线) cross wire(线交叉) 1.线弧上的缺陷:Damaged wire (⾦丝损伤) sagging wire (塌丝) Tight wire (绷线) cross wire(线交叉) Gap<2mil(线隙<2mil)loop too high (线弧⾼) Re-bonding (重复连接错误) missing wire(漏线) Gap<2mil(线隙<2mil) loop too high (线弧⾼) Re-bonding (重复连接错误) missing wire(漏线)
broking wire (引线断裂)NSOP(压点上未焊牢) wire debris(碎线) wire short (引线短路) broking wire (引线断
裂)NSOP(压点上未焊牢) wire debris(碎线) wire short (引线短路)
2.线和球交接处的缺陷:broking wire(引线断裂)颈部受损 bond tail (键压点拖尾) 2.线和球交接处的缺陷:broking
wire(引线断裂)颈部受损 bond tail (键压点拖尾)
3.球和芯⽚上⾯的缺陷:ball size too big or too small(球太⼤或太⼩) off center bond(偏离压点中⼼) 3.球和芯⽚上⾯的缺陷:ball size too big or too small(球太⼤或太⼩) off center bond(偏离压点中⼼)Stitch bond size too big or too small(焊点尺⼨太⼤或太⼩)Lift ball(浮起第⼀焊点)Stitch bond size too big or too small(焊点尺⼨太⼤或太⼩)Lift ball(浮起第⼀焊点)
托马斯火车图片
Ball thickness too big or too small(球厚度太⼤或太⼩) wrong bond (错误键压)Ball thickness too big or too small(球厚度太⼤或太⼩) wrong bond (错误键压)
Golf ball bond(⾼尔夫球状⾦线键压)Bond too scribe(键压到轮廓线)no bond (⽆键合Golf ball bond(⾼尔夫球状⾦线键压)Bond too scribe(键压到轮廓线)no bond (⽆键合仔细的仔怎么组词
Pad cratering(弹坑) Smash bond (粉碎型键合) Wire Debris(碎线)⾦球外溢Pad cratering(弹坑) Smash bond (粉碎型键合) Wire Debris(碎线)⾦球外溢高跟鞋先生
Partially lifted stitch(部分浮起焊点)Lift stitch(浮起焊点) CAP 印(劈⼑印)Partially lifted stitch(部分浮起焊点)Lift stitch(浮起焊点) CAP 印(劈⼑印)
Tail length(线尾长度)Wire avulsion quality(铝线撕扯质量)焊点错位Tail length(线尾长度)Wire avulsion quality(铝线撕扯质量)焊点错位
Lifted metal (peeling)(⾦属层提拉) Wedge size(焊点尺⼨)Lifted metal (peeling)(⾦属层提拉) Wedge size(焊点尺⼨)4.芯⽚上的缺陷: Ink die(墨点芯⽚ edge die(边缘芯⽚) Die location/Rotation(芯⽚位置/旋转) 4.芯⽚上的缺陷: Ink die(墨点芯⽚ edge die(边缘芯⽚) Die location/Rotation(芯⽚位置/旋转)
cpu正常温度
crack(开裂) epoxy/solder on die (芯⽚上有银浆)scratch(划伤)Contam on die(芯⽚沾污)crack(开裂) epoxy/solder on die (芯⽚上有银浆)scratch(划伤)Contam on die(芯⽚沾污)
Die tilt(芯⽚倾斜) stack die(芯⽚重叠) missing die (漏芯⽚)die displacement(芯⽚错位) Die tilt(芯⽚倾斜) stack die(芯⽚重叠) missing die (漏芯⽚)die displacement(芯⽚错位)
NG die(不良芯⽚) collet mark on die 吸嘴压伤 Overturned die(芯⽚翻转)NG die(不良芯⽚) collet mark on die 吸嘴压伤Overturned die(芯⽚翻转)
Foreigh Material on Die(芯⽚上有异物) wrong die orientation(芯⽚⽅向)Foreigh Material on Die(芯⽚上有异物) wrong die orientation(芯⽚⽅向)
misalign saw(切割偏位)void die(压点缺损) 铝层卷起⼩⽿朵 chip(缺⾓)misalign saw(切割偏位)void die(压点缺损) 铝层卷起⼩⽿朵 chip(缺⾓)
5.芯⽚与PAD交接处的缺陷:epoxy fillet height(侧⾯银浆⾼度)epoxy/solder void(环氧树脂⽓孔) 5.芯⽚与PAD交接处的缺陷:epoxy fillet height(侧⾯银浆⾼度)epoxy/solder void(环氧树脂⽓孔)
Epoxy/solder coverage(银浆覆盖⾯积) ⽩板 die chip Epoxy/solder coverage(银浆覆盖⾯积) ⽩板 die chip
6.第⼆焊点与lead的缺陷:NSOL edge bond(键压到边缘)虚焊 6.第⼆焊点与lead的缺陷:NSOL edge bond(键压到边缘)虚焊
第⼆焊点隐裂第⼆焊点卷起鱼尾不良 Overlap bond on lead(管脚重叠键合)第⼆焊点隐裂第⼆焊点卷起鱼尾不良 Overlap bond on lead(管脚重叠键合)
7.框架上的缺陷:epoxy on l/f(在L/F上有银浆) Lead frame Discoloration(引线框架氧化)7.框架上的缺陷:epoxy on l/f(在L/F 上有银浆) Lead frame Discoloration(引线框架氧化)
Bent Tie Bar(Tie Bar 弯折))Lead Short(引脚短路)Tilt or twist:(翘曲或者扭曲)Bent Tie Bar(Tie Bar 弯折))Lead Short(引脚短路)Tilt or twist:(翘曲或者扭曲)
PAD上翘/下陷 Passivation defects((钝化层缺陷 ) 框架变形镀银层不全PAD上翘/下陷 Passivation defects((钝化层缺陷 ) 框架变形镀银层不全
Discolored DAP back:(DAP 背⾯变⾊)Bent Frame(引线框架弯折受损)Discolored DAP back:(DAP 背⾯变⾊)Bent Frame(引线框架弯折受损)
1.线弧上的缺陷:Damaged wire (⾦丝损伤) sagging wire (塌丝) Tight wire (绷线) cross wire(线交叉) 1.线弧上的缺陷:Damaged wire (⾦丝损伤) sagging wire (塌丝) Tight wire (绷线) c
一至三年级ross wire(线交叉) Gap<2mil(线隙<2mil)loop too high (线弧⾼) Re-bonding (重复连接错误) missing wire(漏线) Gap<2mil(线隙<2mil) loop too high (线弧⾼) Re-bonding (重复连接错误) missing wire(漏线)
broking wire (引线断裂)NSOP(压点上未焊牢) wire debris(碎线) wire short (引线短路) broking wire (引线断
裂)NSOP(压点上未焊牢) wire debris(碎线) wire short (引线短路)
2.线和球交接处的缺陷:broking wire(引线断裂)颈部受损 bond tail (键压点拖尾) 2.线和球交接处的缺陷:broking
wire(引线断裂)颈部受损 bond tail (键压点拖尾)
3.球和芯⽚上⾯的缺陷:ball size too big or too small(球太⼤或太⼩) off center bond(偏离压点中⼼) 3.球和芯⽚上⾯的缺陷:ball size too big or too small(球太⼤或太⼩) off center bond(偏离压点中⼼)Stitch bond size too big or too small(焊点尺⼨太⼤或太⼩)Lift ball(浮起第⼀焊点)Stitch bond size too big or too small(焊点尺⼨太⼤或太⼩)Lift ball(浮起第⼀焊点)
Ball thickness too big or too small(球厚度太⼤或太⼩) wrong bond (错误键压)Ball thickness too bi
g or too small(球厚度太⼤或太⼩) wrong bond (错误键压)
Golf ball bond(⾼尔夫球状⾦线键压)Bond too scribe(键压到轮廓线)no bond (⽆键合Golf ball bond(⾼尔夫球状⾦线键压)Bond too scribe(键压到轮廓线)no bond (⽆键合
Pad cratering(弹坑) Smash bond (粉碎型键合) Wire Debris(碎线)⾦球外溢Pad cratering(弹坑) Smash bond (粉碎型键合) Wire Debris(碎线)⾦球外溢
Partially lifted stitch(部分浮起焊点)Lift stitch(浮起焊点) CAP 印(劈⼑印)Partially lifted stitch(部分浮起焊点)Lift stitch(浮起焊点) CAP 印(劈⼑印)
Tail length(线尾长度)Wire avulsion quality(铝线撕扯质量)焊点错位Tail length(线尾长度)Wire avulsion quality(铝线撕扯质量)焊点错位
Lifted metal (peeling)(⾦属层提拉) Wedge size(焊点尺⼨)Lifted metal (peeling)(⾦属层提拉) Wedge size(焊点尺⼨)4.芯⽚上的缺陷: Ink die(墨点芯⽚ edge die(边缘芯⽚) Die location/Rotation(芯⽚位置/旋转) 4.芯⽚上的缺陷: Ink die(墨点芯⽚ edge die(边缘芯⽚) Die location/Rotation(芯⽚位置/旋转)
crack(开裂) epoxy/solder on die (芯⽚上有银浆)scratch(划伤)Contam on die(芯⽚沾污)crack
(开裂) epoxy/solder on die (芯⽚上有银浆)scratch(划伤)Contam on die(芯⽚沾污)
Die tilt(芯⽚倾斜) stack die(芯⽚重叠) missing die (漏芯⽚)die displacement(芯⽚错位) Die tilt(芯⽚倾斜) stack die(芯⽚重叠) missing die (漏芯⽚)die displacement(芯⽚错位)
NG die(不良芯⽚) collet mark on die 吸嘴压伤 Overturned die(芯⽚翻转)NG die(不良芯⽚) collet mark on die 吸嘴压伤Overturned die(芯⽚翻转)
Foreigh Material on Die(芯⽚上有异物) wrong die orientation(芯⽚⽅向)Foreigh Material on Die(芯⽚上有异物) wrong die orientation(芯⽚⽅向)
misalign saw(切割偏位)void die(压点缺损) 铝层卷起⼩⽿朵 chip(缺⾓)misalign saw(切割偏位)void die(压点缺损) 铝层卷起⼩⽿朵 chip(缺⾓)
5.芯⽚与PAD交接处的缺陷:epoxy fillet height(侧⾯银浆⾼度)epoxy/solder void(环氧树脂⽓孔) 5.芯⽚与PAD交接处的缺
陷:epoxy fillet height(侧⾯银浆⾼度)epoxy/solder void(环氧树脂⽓孔)
Epoxy/solder coverage(银浆覆盖⾯积) ⽩板 die chip Epoxy/solder coverage(银浆覆盖⾯积) ⽩板 die chip
6.第⼆焊点与lead的缺陷:NSOL edge bond(键压到边缘)虚焊 6.第⼆焊点与lead的缺陷:NSOL edge bond(键压到边缘)虚焊
第⼆焊点隐裂第⼆焊点卷起鱼尾不良 Overlap bond on lead(管脚重叠键合)第⼆焊点隐裂第⼆焊点卷起鱼尾不良 Overlap bond on lead(管脚重叠键合)
7.框架上的缺陷:epoxy on l/f(在L/F上有银浆) Lead frame Discoloration(引线框架氧化)7.框架上的缺陷:epoxy on l/f(在L/F 上有银浆) Lead frame Discoloration(引线框架氧化)
Bent Tie Bar(Tie Bar 弯折))Lead Short(引脚短路)Tilt or twist:(翘曲或者扭曲)Bent Tie Bar(Tie Bar 弯折))Lead Short(引脚短路)Tilt or twist:(翘曲或者扭曲)
PAD上翘/下陷 Passivation defects((钝化层缺陷 ) 框架变形镀银层不全PAD上翘/下陷 Passivation defects((钝化层缺陷 ) 框架变形镀银层不全
Discolored DAP back:(DAP 背⾯变⾊)Bent Frame(引线框架弯折受损)Discolored DAP back:(DAP 背⾯变⾊)Bent Frame(引线框架弯折受损)

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