专利名称：FLIP CHIP BALL GRID ARRAY WITH LOW
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IMPEDNCE AND GROUNDED LID
发明人：Martin Beaumier,Yves Dallaire,Melania C.
Doll,Michael Gaynes,Edward J. Yarmchuk
教育叙事初中申请号：US15655590
申请日：20170720仿佛的佛的组词
公开号：US20180090406A1
公开日：
20180329
专利内容由知识产权出版社提供
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特别的真正近义词专利附图：
摘要：A contact spring for placement in a gap between an electrical substrate
opposite a lid (electrically conductive heat spreader) of an electronic device compris a
下元节是什么节>两股辫的编法图解
spring that both conducts heat from the substrate to the lid and electrically connects the substrate and lid. The spring compris a flat single element configured as a plurality of polygons, providing contact points, the spring substantially lying in a plane and extending substantially in a straight line, or a spiral. The spring in an electronic device such as a flip chip ball grid array having this lid and an electrical substrate with EMI emitters: (1) provides low impedance electrical connection between the electronic circuit and lid; (2) grounds the lid to the electronic circuit; (3) minimizes EMI in the electronic circuit; (4) conducts heat from the electronic circuit to the lid; or any one or combination of the foregoing features (1)-(4).
申请人：International Business Machines Corporation
地址：Armonk NY US
国籍：US
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