专利名称：Heat spreader ball grid array (HSBGA)吉他六弦
design for low-k integrated circuits (IC)
发明人：Yian-Liang Kuo,Yung-Sheng Huang,Yu-Ting
怎么加微信好友>中班美工区
Lin
申请号：US10718192
申请日：20031120
公开号：US07180173B2
公开日：
上场音乐
倚组词
20070220
六年级一班专利内容由知识产权出版社提供
专利附图：
摘要：A method of forming a heat spreader ball grid array package, and the resultant heat spreader ball grid array package, comprising the following steps. A miconductor
网路电话chip affixed to a ball grid substrate is provided. The miconductor chip over the ball grid substrate is encad with a molding compound. A heat spreader is mounted over the ball grid substrate and spaced apart from the molding compound to form a gap. Thermal grea is placed into the gap, at least between the heat spreader and the molding compound, to form the heat spreader ball grid array package. It is also possible to place thermal grea over the molding compound and then mounting the heat spreader over the ball grid substrate.
申请人：Yian-Liang Kuo,Yung-Sheng Huang,Yu-Ting Lin
地址：Hsinchu TW,Hsin-Chu TW,Hsin-Chu TW
国籍：TW,TW,TW
代理机构：Thomas, Kayden, Horstemeyer & Risley
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