AEC - Q003 July 31, 2001
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Component Technical Committee
Automotive Electronics Council
AEC – Q003
July 31, 2001 Automotive Electronics Council
Component Technical Committee
Acknowledgment
Any document involving a complex technology brings together material and skills from many sources. The Automotive Electronics Council would especially like to recognize the following significant contributors to the development of this document:
Majdi Mortazavi DaimlerChrysler (256)464-2249
Brian Jendro DaimlerChrysler (256)464-2980
Detlef Griessman Delphi Delco Electronics Systems (765)451-9623
Robert V. Knoell Visteon Corporation (313)755-0162
Nick Lycoudes Motorola (408)413-3343 raqa01@m
Mark Yasin Motorola AIEG (830)372-7200 Mark_m Philippe Briot PSA, Peugeot, Citroën 33 01 41 36 7849 p-briot@psinet.fr
Mark Gabrielle On Semiconductor (602)244-3115 mark.
Enrico Valacca Magneti Marelli 39 382 59 9650 enrico.valacca@pavia.marelli.it
Wilhelm Mayer Temic 49 841 881 2321 wilhelm.
Jeff Parker International Rectifier (909)375-4415
Gerald E. Servais Delphi – retired (765)883-5473 gervais@iquest
Component Technical Committee
Guideline
For
The Characterization of Integrated Circuits
党的六项纪律1. PURPOSE:
The characterization of ICs is an extremely important function during the development of a new IC or the modification of an existing IC. The purpo of this document is to provide guidance by highlighting important considerations that should be evaluated during development of a
characterization procedure. This document is not intended to be a specification on how to
perform a characterization. To ensure consistent characterization every company should have a stru
ctured and documented characterization procedure. The characterization process should be ud to ensure that the design & wafer fab/asmbly process being utilized demonstrate打折怎么算
sufficient capability of providing a part that meets the requirements of the customer. The results of every characterization should be documented in a Characterization Report.
2. SCOPE:
This guideline document provides the basis for establishing a procedure for characterizing the electrical performance of Integrated Circuit products. This characterization procedure should be ud for new technologies, new wafer fabrication process, new product designs and
寿司配料significantly modified ICs.
3. DEFINITIONS:
德国基尔大学3.1 Device Electrical Parameters
Electrical measurements specified in the part specification for the device, and / or other
measurements as indicated by engineering experience for the technology involved.
3.2 Characterization
The process of determining the fundamental electrical and physical characteristics (voltage,
frequency, and temperature behavior) of a device bad on statistical analysis of experimental data or modeling. This includes the distribution of an electrical parameter as a function of other parameter(s) variation. The graphical prentation of the characterization for a typical electrical parameter is a multivariate hyper - ellipsoid, e Figure 1 (frequently called a Schmoo Plot).
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Component Technical Committee
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Figure 1 Schmoo Plot
3.3 Criteria For Characterization
A device that meets the following criteria should be considered a candidate for characterization.This criteria should not be considered a limitation but a starting point for factors to consider.
• new chip layout or changes to an existing die that could impact electrical parameters
(e.g., die shrink)
• new cell structure(s) which have not been ud in production components • new processing methods or materials
• new operating bias condition requirements (re-characterize at new bias extremes)
• significant increa in operating environmental condition requirements (re-characterize
at new environmental extremes)
3.4Specification Limits (e.g., data sheet limits):
Numerical values of maximum, minimum, and typical electrical parameters specified in the customer
s part specification or the supplier data sheet. The values are ud to determine pass / fail criteria for the characterization.
3.5 Guard Bands:
The difference between test limits and specification limits. Test limits are generally tighter than specification limits to account for tester inaccuracies and other sources of variation.
4. CHARACTERIZATION PROCEDURE:
This guideline is not intended to establish the characterization process / procedure, but is intended to provide an outline of factors that should be considered when establishing a
characterization procedure. Every supplier should establish a characterization procedure. The characterization procedure should include the following major activities for the device to be characterized:
Test Limit
北极熊的英文Each dot is a measurement from one part
Guard Band measurement
Specification limit
Parameter 1
Pa ra m et er 2
P a r a m e
t e r
2
Component Technical Committee
•Review of PFMEA (process FMEA), DFMEA (design FMEA) and the related Control Plans or equivalent methods that link failures to the manufacturing process and design
process.
•Determination of the characterization method to be ud.
•Establishment of the parameters to be characterized.
•Completion of a characterization report.
4.1 Device Characterization:
The characterization of new parts requires a procedure that provides in-depth information about the capability of the part design / process to produce the part. Before beginning the
characterization procedure review the Characterization Checklist, e Appendix 1. This
characterization procedure should include measuring to the part specification requirements
across the operating voltages, frequencies, and temperatures or the u of documented
simulation methods. (Note: Although not included in the characterization, it is important to
determine the ESD, Latch-up, and Generic Leakage capability of a part early in the development cycle as the parameters could have a significant impact on the performance of the part.) The characterization methods ud (e Appendix 2, and 3) should be clearly documented in a
Characterization Report.
4.2Characterization Report
The characterization report should include the following:
1. A summary of the PFMEA (Process FMEA) and DFMEA (Design FMEA) and the related
Control Plans or equivalent methods that link failures to the manufacturing process and
design process.
2. A detailed discussion of the characterization methods ud (e Appendixes 1, 2, and
3).
3. A listing of all critical parameters monitored during the characterization. A listing of all
critical parameters that do not show a Design Index of 1 or greater (e Appendix 4) or a
Cpk of 1.33 to the specification test limits.
4.Discussion of device weakness and corrective actions, both design and process
related.
5.Containment plans for handling uncorrected part weakness and reliability
concerns. (e.g., voltage stress test or burn-in to contain gate oxide defects.)
6.The report should be approved by a responsible supplier reprentative.
The results of the characterization should be shared with the customer (at the discretion
of the supplier this sharing may include a hard copy of the characterization report or lected
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portions of the characterization report).
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