COMPOSITE MODULE

更新时间:2023-07-26 01:44:29 阅读: 评论:0

专利名称:COMPOSITE MODULE
发明人:Hiromichi KITAJIMA乐彤彤
申请号:US14551284
申请日:20141124
公开号:US20150080050A1
公开日:
房产管理
20150319
世间最美的坟墓
专利内容由知识产权出版社提供
狗图片头像
专利附图:月季怎么修剪
摘要:A composite module includes outer ground electrodes on one main surface of a wiring substrate, a wiring electrode inside the wiring substrate, and a first ground electrode between the wiring electrode and the outer ground electrode. A cutout is provided in the first ground electrode at least at a portion of a region overlapping with
the wiring electrode and the outer ground electrode when viewed from above, and the wiring electrode overlaps with at least one of the first ground electrode and the outer ground electrode when viewed from above to reduce stray capacitance produced on the wiring electrode and to adjust impedance of the wiring electrode while preventing signals leaked from the exterior from interfering with the wiring electrode.
申请人:Murata Manufacturing Co., Ltd.信息化建设方案
地址:Nagaokakyo-shi JP
小李琳老公国籍:JP
更多信息请下载全文后查看
>防欺凌黑板报

本文发布于:2023-07-26 01:44:29,感谢您对本站的认可!

本文链接:https://www.wtabcd.cn/fanwen/fan/89/1096772.html

版权声明:本站内容均来自互联网,仅供演示用,请勿用于商业和其他非法用途。如果侵犯了您的权益请与我们联系,我们将在24小时内删除。

标签:专利   知识产权   出版社   内容   全文
相关文章
留言与评论(共有 0 条评论)
   
验证码:
推荐文章
排行榜
Copyright ©2019-2022 Comsenz Inc.Powered by © 专利检索| 网站地图