All products listed in this specification are developed, designed and intended for u in general electronics equipment. The products are not designed or warranted to meet the requirements of the applications listed below, who performance and/or quality require especially high reliability, or who failure, malfunction or trouble might directly cau damage to society, person, or property. Plea understand that we are not responsible for any damage or liability caud by u of the products in any of the applications below. Plea contact us for more details if you intend to u our products in the following applications.
1.Aircraft equipment
2.Aerospace equipment
3.Undera equipment
4.nuclear control equipment
5.military equipment
6.Power plant equipment
7.Medical equipment
8.Transportation equipment (automobiles, trains, ships,etc.)
9.Traffic signal equipment
10.Disaster prevention / crime prevention equipment
11.Data-processing equipment
12. Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
This specification applies to CWS5025H-102T wire wound chip common mode choke coil
2.
Product Description and Identification (Part Number) 1) Description
Wire Wound Chip Common Mode Choke Coil, CWS5025H-102T, , 2) Product Identification (Part Number)
CWS 5025 H - 102 T ① ② ③ ④ ⑤
3.
Electrical Characteristics
Plea refer to Appendix A （Page 6）
1) Operating temperature (Including lf-generated heat): -40℃~+125℃
2) Storage temperature and humidity range (product with taping ): 0℃~+40℃, RH 70% Max.
4.
Shape and Dimensions
1) Dimensions and recommended PCB pattern for reflow soldering:
2)
Structure and Components
5.
Test and Measurement Procedures 5.1 Test Conditions
5.1.1 Unless otherwi specified, the standard atmospheric conditions for measurement/test as:
a. Ambient Temperature: 20±15℃
b. Relative Humidity: 65±20%
c. Air Pressure: 86 KPa to 106 KPa
5.1.2 If any doubt on the results, measurements/tests should be made within the following limits:
a. Ambient Temperature: 20±2℃
b. Relative Humidity: 65±5%
c. Air Pressure: 86KPa to 106 KPa
Unit: mm
Pad layout
5.2 Visual Examination
a. Inspection Equipment: 20 X magnifier
5.3 Electrical Test
5.3.1 DC Resistance (DCR)
a. Refer to Appendix A.
纳米材料的应用b. Test equipment (Analyzer): HIOKI3540 or equivalent.
5.3.2 Inductance (L)
a. Refer to Appendix A.
b. Test equipment: WK3260B equivalent.
5.3.3 Rated Current
a. Refer to Appendix A.
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b. Test equipment: Agilent E3633A, NF ZM2355, R2M-2H3 or equivalent..
c. Definition of Rated Current (Ir): With the condition of the DC current pass, compare to the temperature ri by40℃, the
smaller is Rated Current.(reference environment temperature:25℃)
The test samples shall be soldered to the test
6.王语心
Packaging艺伎禁密史
6.1 Reel and Taping Dimensions:
6.2 Packaging Quantity:
7.
Recommended Soldering Technologies 7.1 Re-flowing Profile: △ 1~2 ℃/c. Ramp
△ Pre-heating: 150~190℃/90±30 c. △ Time above 240℃: 20~40c
△ Peak temperature: 255℃ Max./5c; △ Solder paste: Sn/3.0Ag/0.5Cu △ Max.2 times for Re-flowing
8. Supplier Information
a) Supplier:
天策Shenzhen Sunlord Electronics Co., Ltd. b) Manufacturer:
Shenzhen Sunlord Electronics Co., Ltd. c) Manufacturing Address:
Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China Zip: 518110
Appendix A: Electrical Characteristics (@ 25℃)
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Electrical Schematics:
255℃名列前茅造句
200℃
150℃顺产后多久可以同房
