专利名称：Chip stack, method of fabrication thereof,
广式
and miconductor package having the same感恩教育演讲稿
发明人：Jong-Joo Lee
申请号：US11710490
申请日：20070226一年级好句
公开号：US20070278657A1
公开日：
行业风险类别
20071206
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专利附图：
摘要：A chip stack may include a first miconductor chip and a cond miconductor chip stacked on the first miconductor chip. Each miconductor chip may have an active surface, a back surface opposite to the active surface, and a plurality of connection pads
如何做pptarranged in the center of the active surface. At least one through electrode may be formed in the first miconductor chip and may be connected to at least one of the plurality of connection pads, and a portion of the at least one through electrode may be expod by the back surface of the first miconductor chip. The active surface of the first miconductor chip may be arranged to face the active surface of the cond miconductor chip. The plurality of connection pads of the first miconductor chip may be electrically connected to the plurality of connection pads of the cond miconductor chip.
申请人：Jong-Joo Lee
地址：Suwon-si KR
国籍：KR
雨诗句
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