专利名称：BUMPED FILM CARRIER AND
MANUFACTURE THEREOF
发明人：OKAMOTO JIYUNICHI,HATADA KENZOU 申请号：JP19634783
申请日：19831020
说性公开号：JPS6088452A
公开日：
感恩节游戏
王菲新专辑
19850518五年级下册语文作文
课题结题报告
专利内容由知识产权出版社提供夜上受降城闻笛朗诵
真字成语摘要：PURPOSE:To obtain the titled carrier suitable for fine patterning, capable of easy manufacture, and excellent in mass productivity at a low cost by a method wherein a bump consisting of the first and cond Au layers having specific purities is thermocompression-bonded to the tip of a lead of the film carrier. CONSTITUTION:The bump 8 provided at the tips of a plurality of leads 2 extending to the device hole of a flexible insulation film 1 has the cond Au layer 8b having a purity of 50% or more which is smaller than that of the first Au layer 8a, formed on this layer 8a having a purity of 99.0% or more. Thereby, at the time of junction to a miconductor element 4, becau of the hardness of the Au layer 8b of a lower purity, the short-circuit of the bumps can be inhibited by keeping the spread of the bump due to collap to an extremely small degree. Besides, the leads are blocked from sinking in the bumps, and thus the contact thereof with the element edge can be prevented.牙痛吃什么药最快见效
申请人：MATSUSHITA DENKI SANGYO KK
更多信息请下载全文后查看
