怎样切菠萝
专利名称：WAFER BACK SIDE COATING AS DICING TAPE ADHESIVE
罗恩阿泰斯特发明人：DUTT, Gyanendra,HOANG,每下愈况
Elizabeth,RUATTA, Stephen,ZHUO, Qizhuo 申请号：IB2014/000681
申请日：20140204
红高粱的作者是谁公开号：WO2014/122534A3
公开日：
20141127
古墓丽影9攻略
专利内容由知识产权出版社提供
摘要：A miconductor asmbly compris a miconductor wafer, an adhesive coating dispod on the back side of the wafer, and a bare dicing tape, preferably UV radiation transparent. The asmbly is prepared by the method comprising (a) providing a miconductor wafer, (b) disposing a wafer back side coating on the miconductor wafer, (c) partially curing the wafer back side coating to the extent that it adheres to the back side of the wafer and remains tacky, and (d) contacting the bare dicing tape to the partially cured and tacky wafer back side coating, optionally with heat and pressure.
ipad游戏没有声音
申请人：HENKEL IP & HOLDING GMBH
地址：DE
番茄大虾的家常做法国籍：DE日本纯肉动漫
更多信息请下载全文后查看
