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专利名称：Conductive adhesive 发明人：坂本 孝史，神田 大樹
申请号：JP2019034426
字体有哪些
气球小熊申请日：20190227
广式月饼
公开号：JP2020139020A
公开日：
孕吐严重怎么办
20200903
专利内容由知识产权出版社提供
汤圆的传说摘要：Problem to be solved: to provide a conductive adhesive having high fluidity and conductivity. (a) a conductive adhesive comprising (a) an electrically conductive particle, (b) solvent, (c) a thermotting resin and (d) average particle size of 1 to 50 nm.Here, (a) when the total weight of the conductive particles, (b) solvent, (c) thermotting resin and (d) silica particles is 100 parts by weight, (1) containing 1 to 20 parts by weight of silica particles, and (b) 0.5 to 15 parts by weight of the solvent.The conductive particles are silver particles.No lection
申请人：ナミックス株式会社
地址：新潟県新潟市北区濁川３９９３番地
少年闰土课文原文国籍：JP
代理人：特許業務法人 津国
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