The device and method in order to remove the wafer

更新时间:2023-07-18 13:19:51 阅读: 评论:0

专利名称:The device and method in order to remove
the wafer from the carrier
发明人:エリッヒ・タールナー
申请号:JP2012500135
随心所欲的近义词
申请日:20100316
公开号:JP2012521079A
公开日:
20120910
专利内容由知识产权出版社提供
专利附图:qq主页
摘要: The wafer the device in order to remove from the carrier which is connected to the wafer at link layer has with the receipt expedient in order to mount the carrier - wafer asmbly body which consists of the carrier wafer, and the connected ction removal method which breaks the connected ction of link layer between the carrier wafers and the removing expedient which removes the wafer from the carrier connected ction removal method, 0 - the 350 , desirably inside the temperature range of 20 - the 80 ,
furthermore desirably, in order to operate at environmental temperature, is formed. This invention receives this method, furthermore in regard to the method in order to remove
the wafer from the carrier, mounts the carrier - wafer asmbly body which consists of with the carrier and the wafer in taker Danziyou, with connected ction removal method breaks the connected ction which was offered by the link layer with the carrier and the wafer removes and the wafer or includes the step which does the carrier from the wafer from the carrier due to the device, connected ction removal method, inside the above-mentioned temperature range to the 350 , operates desirably at environmental temperature.傍山险路
申请人:エーファウ・グループ・ゲーエムベーハー
放假安排
云冈石窟旅游攻略地址:オーストリア・A-4782・ザンクト・フローリアン・デーイー・エリヒ・タル
初中小说ナー・シュトラーセ・1
国籍:AT藏红花怎么种植
怎么才能入党代理人:村山 靖彦,志賀 正武,渡邊 隆,実広 信哉
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