Wafer bevel polymer removal

更新时间:2023-07-18 12:40:56 阅读: 评论:0

专利名称:Wafer bevel polymer removal
手机清理缓存发明人:Jeremy Chang,Andreas Fischer,Peter中国旗袍
Loewenhardt
申请号:US10934081
申请日:20040903
公开号:US07597816B2
公开日:
岛上书店20091006
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专利内容由知识产权出版社提供
名胜古迹英语
专利附图:
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摘要:A method of forming a miconductor device is provided. A wafer with a dielectric layer dispod under a photoresist mask is placed in an etch chamber. The dielectric layer is etched. The wafer is raid. A cleaning gas is provided. A plasma is
formed from the cleaning gas. A polymer that has formed on the bevel of the wafer is removed using the plasma from the cleaning gas. The wafer is removed from the etch chamber.
申请人:Jeremy Chang,Andreas Fischer,Peter Loewenhardt
地址:Sunnyvale CA US,Castro Valley CA US,Pleasanton CA US
崔成林
国籍:US,US,US
电梯维保合同
代理机构:Beyer Law Group LLP
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