专利名称：Substrate structure having N-SMD ball pads
发明人：Pai-Chou Liu,Yu-Hsin Lee
申请号：US11651540
申请日：20070110
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蒙多符文公开号：US20080042278A1
萧萧黄叶闭疏窗公开日：
20080221
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摘要：The prent invention relates to a substrate structure having non-solder mask design (N-SMD) ball pads. The substrate structure compris a substrate and a solder mask. The substrate ha
s a first surface, a trace layer and at least one ball pad. The ball pad and the trace layer are dispod on the first surface. The trace layer has a plurality of
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traces, and at least one trace electrically connects to the ball pad. The solder mask has at least one opening corresponding the ball pad. The size of the opening is larger than that of the ball pad. The solder mask covers the trace connecting to the ball pad. By utilizing the substrate structure of the invention, the problem of non-alignment of the solder ball can be solved, and the hole in the solder ball can be prevented when the substrate structure is welded with a PCB so that the reliability of solder ball welding can be improved.
申请人：Pai-Chou Liu,Yu-Hsin Lee
地址：Kaohsiung TW,Kaohsiung TW
白羊座的男明星国籍：TW,TW
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