IPC TM-650实验方法手册

更新时间:2023-07-14 06:17:28 阅读：评论：0

IPC TM-650实验方法手册

IPC TM-650 Test Methods Manual

IPC Member Testing Laboratories List
Section 1.0	Reporting and Measurement Analysis Methods
Section 2.1	Visual Test Methods
Section 2.2	Dimensional Test Methods
Section 2.3	Chemical Test Methods
Section 2.4	Mechanical Test Methods
Section 2.5	Electrical Test Methods
Section 2.6	Environmental Test Methods

SECTION 1.0 - Reporting and Measurement Analysis Methods

1.1	Introduction
1.2	Calibration
1.3	Ambient Conditions
1.4	Reporting, General
1.5	Reporting, Format
1.6	Numerical Reporting
1.7	Reporting, Invalid Test Results
1.8	Measurement Precision Estimation for Binary Data - 1/03
	Measurement Precision Calculator-Binary Data
	Measurement Precision Calculator Urs Guide (for u with test method 1.8)
1.9	Measurement Precision Estimation for Variables Data - 1/03
	Measurement Precision Calculator-Variable Data
	Measurement Precision Calculator Urs Guide (for u with test method 1.9)

SECTION 2.1 - VISUAL TEST METHODS

2.1.1D	Microctioning - 3/98
2.1.1.1	Microctioning, Ceramic Substrate - 12/87
2.1.1.2	Microctioning - Semi or Automatic Technique Microction Equipment (Alternate) - 7/93
2.1.2A	Pinhole Evaluation, Dye Penetration Method - 3/76
2.1.3A	Plated-Through Hole Structure Evaluation - 8/76
2.1.5A	Surface Examination, Unclad and Metal Clad Material - 12/82
2.1.6B	Thickness of Glass Fabric - 12/94 宝盖山
2.1.6.1	Weight of Fabric Reinforcements - 12/94
2.1.7C	Thread Count of Glass Fabric - 12/94
2.1.7.1	Thread Count, Organic Fibers - 12/87
2.1.8B	Workmanship - 12/94
2.1.9	Surface Scratch Examination Metal Clad Foil - 5/86
2.1.10A	Visual Inspection for Undissolved Dicyandiamide - 12/94
2.1.13A	Inspection for Inclusions and Voids in Flexible Printed Wiring Materials - 5/98

SECTION 2.2 - DIMENSIONAL TEST METHODS

2.2.1A	Mechanical Dimensional Verification - 8/97
2.2.2B	Optical Dimensional Verification - 8/97
2.2.4C	Dimensional Stability, Flexible Dielectric Materials - 5/98
2.2.5A	Dimensional Inspections Using Mircoctions - 8/97
2.2.6A	Hole Size Measurement, Drilled - 8/97
2.2.7A	Hole Size Measurement, Plated - 5/86
2.2.8	Location of Holes - 4/73
2.2.10A	Hole Location and Conductor Location - 12/83
2.2.12A	Thickness of Copper by Weight- 3/76
2.2.12.1	Overall Thickness and Profile Factor of Copper Foils Treated and Untreated - 9/87
2.2.12.2	Weight and Thickness of Copper Foils with Releasable Carriers - 7/89
2.2.12.3	Weight and Thickness Determination of Copper Foils With Etchable Carriers - 7/89
2.2.13.1A	Thickness, Plating in Holes, Microhm Method - 1/83
2.2.14	Solder Powder Particle Size Distribution - Screen Method for Types 1-4 - 1/95
2.2.14.1	Solder Powder Particle Size Distribution - Measuring Microscope Method - 1/95
2.2.14.2	Solder Powder Particle Size Distribution - Optical Image Analyzer Method--1/95
2.2.14.3	Determination of Maximum Solder Powder Particle Size - 1/95
2.2.15	Cable Dimensions (Flat Cable) - 6/79
2.2.16	Artwork Master Evaluation by U of a Drilled Panel - 12/87
2.2.16.1	Artwork Master Evaluation by Overlay - 12/87
2.2.17	Surface Roughness and Profile of Metallic Foils (Contacting Stylus Technique)- 3/90
2.2.17A	Surface Roughness and Profile of Metallic Foils (Contacting Stylus Technique) - 2/01
2.2.18	Determination of Thickness of Laminates by Mechanical Measurement - 12/94
2.2.18.1	Determination of Thickness of Metallic Clad Laminates, Cross-ctional - 12/94
2.2.19	Measuring Hole Pattern Location-12/87
2.2.19.1	Length, Width and Perpendicularity of Laminate and Prepreg Panels - 12/94
2.2.20	Solder Paste Metal Content by Weight - 1/95
2.2.21	Planarity of Dielectrics for High Density Interconnection (HDI) Microvia Technology - 11-98

SECTION 2.3 - CHEMICAL TEST METHODS

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2.3.1	Chemical Processing, Suitable Processing Material- 4/73
2.3.1.1B	Chemical Cleaning of Metal Clad Laminates- 5/86
2.3.2F	Chemical Resistance Of Flexible Printed Wiring Materials - 5/98
2.3.3A	Chemical Resistance of Insulating Materials- 2/78
2.3.4B	Chemical Resistance, Marking Paints and Inks - 8/97
2.3.4.2A	Chemical Resistance of Laminates, Prepreg and Coated Foil Products, by Solvent Exposure - 12/94
2.3.4.3	Chemical Resistance of Core Materials to Methylene Chloride- 5/86
2.3.5B	Density, Insulating Material - 8/97
2.3.6A	Etching, Ammonium Persulfate Method - 7/75
2.3.7A	Etching, Ferric Chloride Method - 7/75
2.3.7.1A	Cupric Chloride Etching Method - 12/94
2.3.7.2A	Alkaline Etching Method - 12/94
2.3.8A	Flammability, Flexible Insulating Materials- 12/82
2.3.8.1	Flammability of Flexible Printed Wiring- 12/88
2.3.9D	Flammability of Prepreg and Thin Laminate - 8/97
2.3.10B	Flammability of Laminate - 12/94
2.3.10.1	Flammability of Soldermask on Printed Wiring Laminate- 8/98
2.3.11	Glass Fabric Construction- 4/73
2.3.13	Determination of Acid Value of Liquid Solder Flux- Potentiometric and Visual Titration Methods- 1/95
2.3.14	Print, Etch, and Plate Test- 4/73
2.3.15C	Purity, Copper Foil or Plating - 8/97
2.3.16B	Resin Content of Prepreg, by Burn-off - 12/94
2.3.16.1C	Resin Content of Prepeg, by Treated Weight--12/94
2.3.16.2	Treated Weight of Prepreg - 12/94
2.3.17D	Resin Flow Percent of Prepreg - 8/97
2.3.17.1B	Resin Flow of Adhesive Coated Films and Unsupported Adhesive Films - 5/98
2.3.17.2B	Resin Flow of "No Flow" Prepreg - 8/97
2.3.18A	Gel Time, Prepreg Materials - 4/86
2.3.19C	Volatile Content of Prepreg - 12/94
2.3.21	Plating Quality, Hull Cell Method - 8/97
2.3.22	简笔画兔子的画法 Copper Protective Coating Quality - 2-78
2.3.23B	Cure (Permanency) Thermally Cured Solder Mask - 2/88
2.3.23.1A	Cure (Permanency) UV Initiated Dry Film Solder Mask - 2/88
2.3.24	Porosity of Gold Plating- 2/78
2.3.24.1	Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method - 10/85
2.3.24.2A	Porosity of Metallic Coatings on Copper-Bad Alloys and Nickel (Nitric Acid Vapor Test) - 8/97
2.3.25B	Detection and Measurement of Ionizable Surface Contaminants - 8/97---Superdes 2.3.26 and 2.3.26.1
2.3.25C	Detection and Measurement of Ionizable Surface Contaminants by Resistivity of Solvent Extract - 2/01
2.3.25.1	Ionic Cleanliness Testing of Bare PWBs
2.3.26A	Superded by Test Method 2.3.25
2.3.26.1	Superded by Test Method 2.3.25
2.3.26.2	Mobile Ion Content of Polymer Films - 7/95
2.3.27	Cleanliness Test - Residual Rosin - 1/95
2.3.27.1	Rosin Flux Residue Analysis-HPLC Method - 1/95
2.3.28	Ionic Analysis of Circuit Boards, Ion Chromatography Method - 1/95
2.3.29	Flammability, Flexible Flat Cable- 11/88
2.3.30A	Solvent pH Determination in Anhydrous Flourocarbon Solvents- 11/81
2.3.31	Relative Degree of Cure of U.V. Curable Material - 2/88
2.3.32C	Flux Induced Corrosion (Copper Mirror Method)- 1/95
2.3.33C	Prence of Halides in Flux, Silver Chromate Method - 1/95
2.3.34B	Solids Content, Flux - 1/95
2.3.34.1B	Percentage of Flux on/in Flux-Coated and/or Flux-Cored Solder - 1/95
2.3.35B	Halide Content, Quantitative (Chloride and Bromide)- 1/95
2.3.35.1	Fluorides by Spot Test, Fluxes - Qualitative - 1/95
2.3.35.2	Flouride Concentration, Fluxes - Quantitative--1/95
2.3.36	Acid Acceptance of Chlorinated Solvents- 10/85
2.3.37B	Volatile Content of Adhesive Coated Dielectric Films - 5/98
2.3.38B	Surface Organic Contaminant Detection Test - 8/97
2.3.39B	Surface Organic Contaminant Identification Test (Infrared Analytical Method) - 8/97
2.3.40	Thermal Stability - 7/95

SECTION 2.4 - MECHANICAL TEST METHODS

2.4.1D	Adhesion, Tape Testing--8/97
2.4.1.1B	Adhesion, Marking Paints and Inks--11/88
2.4.1.2	Adhesion of Conductors on Hybrid Substrates--12/87
2.4.1.3	Adhesion, Resistors (Hybrid Circuits)--12/87
2.4.1.4	Adhesion, Overglaze (Hybrid Circuits)--12/87
2.4.1.5A	Determination of Heat Transfer--5/95
2.4.1.6	Adhesion, Polymer Coating--7/95
2.4.2A	Ductility of Copper Foil--3/76
2.4.2.1D	Flexural Fatigue and Ductility, Foil--3/91
2.4.3D	Flexural Fatigue, Flexible Printed Wiring Materials--5/98
2.4.3.1C	Flexural Fatigue and Ductility, Flexible Printed Wiring--3/91
2.4.3.2C	Flexural Fatigue and Ductility, Flexible Metal-Clad Dielectrics--3/91
2.4.4B	Flexural Strength of Laminates (at Ambient Temperature)--12/94
2.4.4.1A	Flexural Strength of Laminates (at Elevated Temperature)--12/94
2.4.5	Folding Endurance, Flexible Printed Wiring Materials--4/73
2.4.5.1	Flexibility - Conformal Coating
2.4.6	Hot Oil--4/73
2.4.7A	Machinability, Printed Wiring Materials--7/75
2.4.8C	Peel Strength of Metallic Clad Laminates--12/94
2.4.8.1	Peel Strength, Metal Foil (Keyhole Method for Thin Laminates)--1/86
2.4.8.2A	Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Fluid Method)--12/94
2.4.8.3A	Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Air Method)--12/94
2.4.8.4	Carrier Relea, Thin Copper--1/90
2.4.9D	Peel Strength, Flexible Dielectric Materials--10/88
2.4.9.1	Peel Strength of Flexible Circuits - 11/98
2.4.9.2	Bonding Process - 11/98
2.4.10	Plating Adhesion--4/73
2.4.11	Shear Strength Flexible Dielectric Materials--4/73
2.4.12A	Solderability, Edge Dip Method--6/91
2.4.13F	Solder Float Resistance Flexible Printed Wiring Materials--5/98
2.4.13.1	Thermal Stress of Laminates--12/94
2.4.14	Solderability of Metallic Surfaces--4/73
2.4.14.1	Solderability, Wave Solder Method--3/79
2.4.14.2	Liquid Flux Activity, Wetting Balance Method--1/95
2.4.15A	Surface Finish, Metal Foil--3/76
2.4.16A	Initiation Tear Strength, Flexible Insulating Materials--12/82
2.4.17	Tear Strength, Propagation--4/73
2.4.17.1A	Propagation, Tear Strength, Flexible Insulating Materials--12/82
2.4.18B	Tensile Strength and Elongation, Copper Foil--8/80
2.4.18.1	Tensile Strength and Elongation, In-Hou Plating--8/97
2.4.18.2	Hot Rupture Strength, Foil--7/89
2.4.18.3	Tensile Strength, Elongation, and Modulus--7/95
2.4.19C	Tensile Strength and Elongation, Flexible Printed Wiring Materials--5/98
2.4.20	Terminal Bond Strength, Flexible Printed Wiring--4/73
2.4.21D	Land Bond Strength, Unsupported Component Hole--8/97
2.4.21.1C	Bond Strength, Surface Mount Lands Perpendicular Pull Method--5/91
2.4.22C	Bow and Twist (Percentage)--6/99
点过程 2.4.22.1C	Bow and Twist-Laminate--5/93 枣糕模型
2.4.22.2	Substrate Curvature: Silicon Wafers with Deposited Dielectrics--7/95
2.4.23	Soldering Resistance of Laminate Materials--3/79
2.4.24C	Glass Transition Temperature and Z-Axis Thermal Expansion by TMA--12/94
2.4.24.1	Time to Delamination (TMA Method)--12/94
2.4.24.2	Glass Transition Temperature of Organic Films - DMA Method--7/95
2.4.24.3	Glass Transition Temperature of Organic Films - TMA Method--7/95
2.4.24.4	Glass Transition and Modulus of Materials Ud in High Density Interconnection (HDI) and Microvias -DMA Method - 11/98
2.4.24.5	Glass Transition Temperature and Thermal Expansion of Materials Ud In High Density Interconnection (HDI) and Microvias -TMA Method -11/98
2.4.25C	Glass Transition Temperature and Cure Factor by DSC--12/94
2.4.26	Tape Test for Additive Printed Boards--3/79
2.4.27.1B	Abrasion (Taber Method), Solder Mask and Conformal Coating--1/95
2.4.27.2A	Solder Mask Abrasion (Pencil Method)--2/88
2.4.28B 天之大歌词完整版	Adhesion, Solder Mask (Non-Melting Metals)--8/97
2.4.28.1C	Adhesion, Solder Resist (Mask), Tape Test Method--3/98
2.4.29B	Adhesion, Solder Mask, Flexible Circuit--2/88
2.4.30	Impact Resistance, Polymer Film--10/86
2.4.31A	Folding, Flexible Flat Cable--4/86
2.4.32A	Fold Temperature Testing, Flexible Flat Cable--4/86
温江文庙 2.4.33C	Flexural Fatigue and Ductility, Flat Cable--3/91
2.4.34	Solder Paste Viscosity - T-Bar Spin Spindle Method (applicable for 300,000 to 1,600,000 Centipo)--1/95
2.4.34.1	Solder Paste Viscosity - T-Bar Spindle Method (Applicable at Less Than 300,000 Centipo)--1/95
2.4.34.2	Solder Paste Viscosity - Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipo)--1/95
2.4.34.3	Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipo)--1/95
2.4.34.4	Paste Flux Viscosity - T-Bar Spindle Method--1/95
2.4.35	Solder Paste - Slump Test--1/95
2.4.36B	Rework Simulation, Plated-Through Holes for Leaded Components--8/97
2.4.37A	Evaluation of Hand Soldering Tools for Terminal Connections--7/91
2.4.37.1A	Evaluation of Hand Soldering Tools for Printed Wiring Board Applications--7/91
2.4.37.2	Evaluation of Hand Soldering Tools on Heavy Thermal Loads--7/93
2.4.38A	Prepeg Scaled Flow Testing--6/91
2.4.39A	Dimensional Stability, Glass Reinforced Thin Laminates--2/86
2.4.40	Inner Layer Bond Strength of Multilayer Printed Circuit Boards--10/87
2.4.41	Coefficient of Lintear Thermal Expansion of Electrical Insulating Boards--3/86
2.4.41.1A	Coefficient of Thermal Expansion by the Vitreous Silica (Quartz) Dilatometer Method--8/97
2.4.41.2	Coefficient of Thermal Expansion - Strain Gage Method--8/97
2.4.41.3	In-Plane Coefficient of Thermal Expansion, Organic Films--7/95
2.4.41.4	Volumetric Thermal Expansion Polymer Coatings on Inorganic Substrates--7/95
2.4.42	Torsional Strength of Chip Adhesives--2/88
2.4.42.1	High Tempreature Mechanical Strength Retention of Adhesives--3/88
2.4.42.2	Die Shear Strength--2/98
2.4.42.3	Wire Bond Pull Strength--2/98
2.4.43	Solder Paste - Solder Ball Test--1/95
2.4.44	Solder Paste - Tack Test--3/98
2.4.45	Solder Paste - Wetting Test--1/95
2.4.46	Spread Test, Liquid or Extracted Solder Flux, Solder Paste and Extracted Cored Wires or Preforms--1/95
2.4.47	Flux Residue Dryness--1/95
2.4.48	Spitting of Flux-Cored Wire Solder--1/95
2.4.49	Solder Pool Test--1/95
2.4.50	Thermal Conductivity, Polymer Films--7/95
2.4.51	Self Shimming Thermally Conductive Adhesives--1/95

SECTION 2.5 - ELECTRICAL TEST METHODS

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2.5.1B	Arc Resistance of Printed Wiring Materials--5/86
2.5.2A	Capacitance of Insulating Materials--7/75
2.5.3B	Current Breakdown, Plated Through Holes--8/97
2.5.4	Current Carrying Capacity, Multilayer Printed Wring--4/73
2.5.4.1A	Conductor Temperature Ri Due to Current Changes in Conductors--8/97
2.5.5A	Dielectric Constant of Printed Wiring Materials--7/75
2.5.5.1B	Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Insulating Material at 1MHz (Contacting Electrode Systems)--5/86
2.5.5.2A	Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Clip Method--12/87
2.5.5.3C	Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Materials (Two Fluid Cell Method)--12/87
2.5.5.4	Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Micrometer Method--10/85
2.5.5.5C	Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and Dissipation Factor) at X-Band--3/98
2.5.5.5.1	Stripline Test for Complex Relative Permittivity of Circuit Board Materials to 14 GHZ--3/98
2.5.5.6	Non-Destructive Full Sheet Resonance Test for Permittivity of Clad Laminates--5/89
2.5.5.7	Characteristic Impedance and Time Delay of Lines on Printed Boards by TDR--11/92
2.5.5.8	Low Frequency Dielectric Constant and Loss Tangent, Polymer Films--7/95
2.5.5.9	Permittivity and Loss Tangent, Parallel Plate, 1MHz to 1.5 GHz--11/98
2.5.6B	Dielectric Breakdown of Rigid Printed Wiring Material--5/86
2.5.6.1A	Dielectric Strength, Polymer Solder Mask and/or Conformal Coatings--2/88
2.5.6.2A	Electric Strength of Printed Wiring Material--8/97
2.5.6.3	Dielectric Breakdown Voltage and Dielectric Strength--10/86
2.5.7C	Dielectric Withstanding Voltage, PWB--8/97
2.5.7.1	Dielectric Withstanding Voltage - Polymeric Conformal Coating - 7/00
2.5.8A	Dissipation Factor of Flexible Printed Wiring Material--7/75
2.5.10A	Insulation Resistance, Multilayer Printed Wiring (Between Layers)--12/87
2.5.10.1	Insulation Resistivity for Adhesive Interconnection Bonds--11/98
2.5.11	Insulation Resistance, Multilayer Printed Wiring (Within a Layer)--4/73
2.5.12	Interconnection Resistance, Multilayer Printed Wiring--4/73
2.5.13A	Resistance of Copper Foil--3/76
2.5.14A	Resistivity of Copper Foil--8/76
2.5.15A	Guidelines and Test Methods for RFI-EMI Shielding of Flat Cable--10/86
2.5.16A	Shorts, Internal on Multilayer Printed Wiring--11/88
2.5.17E	Volume Resistivity and Surface Resistance of Printed Wiring Materials--5/98
2.5.17.1A	Volume and Surface Resistivity of Dielectric Materials--12/94
2.5.17.2	Volume Resistivity of Conductive Resistance Ud in High Dentisty Interconnection (HDI) and Microvias, Two-Wire Method--11/98
2.5.18B	Characteristic Impedance Flat Cables (Unbalanced)--7/84
2.5.19A	Propagation Delay of Flat Cables Using Time Domain Reflectometer--7/84
2.5.19.1A	Propagation Delay of Flat Cables Using Time Domain Reflectometer (TDR)--7/84
2.5.21A	Digital Unbalanced Crosstalk, Flat Cable--3/84
2.5.24	Conductor Resistance, Flexible Flat Cable--6/79
2.5.25A	Dielectric Withstand Voltage Flexible Fat Cable--11/85
2.5.26A	Insulation Resistance Flexible Flat Cable--11/85
2.5.27	Surface Insulation Resistance of Raw Printed Wiring Board Material--3/79
2.5.28A	Q Resonance, Flexible Printed Wiring Materials--4/88
2.5.30	Balanced and Unbalanced Cable Attenuation Measurements--12/87
2.5.31	Current Leakage (Through Overglaze Films)--12/87
2.5.32	Resistance Test, Plated Through-Holes--12/87
2.5.33	Measurement of Electrical Overstress from Soldering Hand Tools--11/98
2.5.33.1	Measurement of Electrical Overstress from Soldering Hand Tools (Ground Measurements)--11/98
2.5.33.2	Measurement of Electrical Overstress from Soldering Hand Tools (Transient Measurements)--11/98
2.5.33.3	Measurement of Electrical Overstress from Soldering Hand Tools (Current Leakage Measurements)--11/98
2.5.33.4	Measurement of Electrical Overstress from Soldering Hand Tools (Shielded Enclosure)--11/98

SECTION 2.6 - ENVIRONMENTAL TEST METHODS

2.6.1E	Fungus Resistance Printed Wiring Materials--8/97
2.6.1.1	Fungus Resistance – Conformal Coating --7/00
2.6.2C	Moisture Absorption, Flexible Printed Wiring--5/98
2.6.2.1A	Water Absorption, Metal Clad Plastic Laminates--5/86
2.6.3E	Moisture and Insulation Resistance, Printed Boards--8/97
2.6.3.1C	Moisture and Insulation Resistance-Polymeric Solder Masks and Conformal Coatings--11/98
2.6.3.1D	Moisture and Insulation Resistance - Solder Mask--7/00
2.6.3.2B	Moisture and Insulation Resistance, Flexible Ba Dielectric--5/88
2.6.3.3A	Surface Insulation Resistance, Fluxes--1/95
2.6.3.4A	Moisture and Insulation Resistance – Conformal Coating--7/03
2.6.4A	Outgassing, Printed Boards--8/97
2.6.5C	Physical Shock, Multilayer Printed Wiring--8/97
2.6.6B	Temperature Cycling, Printed Wiring Board--12/87
2.6.7A	Thermal Shock and Continuity, Printed Board--8/97
2.6.7.1	Thermal Shock--Polymer Solder Mask Coatings--2/88
2.6.7.1A	Thermal Shock - Conformal Coating--7/00
2.6.7.2A	Thermal Shock, Continuity and Microction, Printed Board--8/97
2.6.7.3	Thermal Shock - Solder Mask--7/00
2.6.8D	Thermal Stress, Plated Through-Holes--3/98
2.6.8.1	Thermal Stress, Laminate--9/91
2.6.9A	Vibration, Rigid Printed Wiring--8/97
2.6.9.1	Test to Determine Sensitivity of Electronic Asmblies to Ultrasonic Energy--1/95
2.6.9.2	Test to Determine Sensitivity of Electronic Components to Ultrasonic Energy--1/95
2.6.10A	X-Ray (Radiography), Multilayer Printed Wiring Board Test Methods--8/97
2.6.11B	Hydrolytic Stability Solder Mask and/or Conformal Coating--8/98
2.6.11C	Hydrolytic Stability Solder Mask - 7/00
2.6.11.1	Hydrolytic Stability - Conformal Coating - 7/00
2.6.12	Temperature Testing, Flexible Flat Cable--6/79
2.6.13	Asssment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring--10/85
2.6.14A	Resistance to Electrochemical Migration, Polymer Solder Mask--8/87
2.6.14C	Resistance to Electrochemical Migration, Solder Mask--7/00
2.6.14.1	Electrochemical Migration Resistance Test--9/00
2.6.15B	Corrosion, Flux--1/95
2.6.16	Pressure Vesl Method for Glass Epoxy Laminate Integrity--7/85
2.6.16.1	Moisture Resistance of HDIS Under High Temperature and Pressure (Pressure Vesl)--8/98
2.6.17	Hydrolitic Stability, Flexible Printed Wiring Material--12/82
2.6.18A	Low Temperature Flexibility, Flexible Printed Wiring Materials--7/85
2.6.19	Environmental and Insulation Resistance Test of Hybrid Ceramic Multilayer Substrate Boards--12/87
2.6.20A	2.6.20A Superded by J-STD-020A
2.6.21	Service Temperature of Flexible Printed Wiring--12/88
2.6.22	Superded by J-STD-035 (.pdf file)
2.6.23	Test Procedure for Steam Ager Temperature Repeatability--7/93
2.6.24	Junction Stability Under Environmental Conditions
2.6.25	Conductive Anodic Filament (CAF) Resistance Test: X-Y Axis
2.6.26	DC Current Induced Thermal Cycling--5/01

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