专利名称：HOT-COLD SHOCK RESISTANT FLUX
COMPOSITION, SOLDER PASTE
COMPOSITION AND ELECTRONIC CIRCUIT闲暇时间
BOARD
如何排版
发明人：ARAI MASAYA，新井 正也,MATSUO NAOKO，松尾 奈緒子,KATSUYAMA TSUKASA，勝山 司
申请号：JP2015189093截图按键
申请日：20150928
公开号：JP2017064717A
陕西省考真题公开日：
20170406
专利内容由知识产权出版社提供
摘要：PROBLEM TO BE SOLVED: To provide a flux composition that inhibits crack generation and development in a flux residue and a solder joint under an environment with large hot-cold shocks, inhibits solder joint voids and flux spattering, and has good insulation properties of residues.SOLUTION: A flux composition compris (A) a synthetic resin, (B) an activator, (C) a thixotropic agent, and (D) a solvent. The synthetic resin (A) compris an acrylic resin. The activator (B) compris (B-1) a C2-6 fatty acid having Br and a carboxyl group, and (B-2) a compound reprented by general formula (1), where Rto Rare each independently H or a C1-4 alkyl group.SE
方法总比问题多
LECTED DRAWING: None 申请人：TAMURA SEISAKUSHO CO LTD，株式会社タムラ製作所
地址：東京都練馬区東大泉１丁目１９番４３号
国籍：JP写给未来的自己>中老年人学钢琴
代理人：太田 洋子
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