仓鼠饲养八大禁忌
华灯璀璨Voiding Mechanisms in SMT
期刊名称： Soldering and Surface Mount Technology
作者： Hance, W.B.,Lee, N.C.
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年份： 1993年
初三作文大全期号： 第1期勤能补拙的意思
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摘要：The mechanisms for void formation are investigated for applications involving solder paste in surface mount technology. Generally, voids are caud by the outgassing of entrapped flux in the sandwiched solder during reflow. The voiding is dictated mainly by the solderability of metallisation, and increas with decreasing solderability of metallisation, decreasing flux activity, increasing metal load of powder, and increasing coverage area under the lead of the joint. Decrea in the solder powder particle size has only a slightly negative effect on voiding. The data indicate that voiding is also a function of the timing between the coalescing of solder powder and the elimination of immobile metall
isation oxide. The sooner the paste coalescence occurs, the wor the voiding will be. Increa in voiding is usually accompanied 人活着真累
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