Microstructural Study on Kirkendall Void Formation in Sn-Containing/Cu Solder Joints During Solid-弧长的公式
State Aging二年级仿写句子100例
期刊名称： Microscopy & Microanalysis
作者： Zhi-Quan Liu,Pan-Ju Shang,Feifei Tan,Douxing Li
年份： 2013年生宝宝发朋友圈的句子
期号： 第S5期
灌肠好吗关键词： lead-free solder; Kirkendall void; intermetallic compound (IMC);选择商品
diffusion; interface; transmission electron microscopy (TEM)
摘要：Kirkendall void formation at the solder/metallization interface is an important reliability concern for Cu conductors and under-bump metallization in microelectronic packaging industry, who mechanism is still hard to be understood for different individual cas. In the prent work, two typical
solder/Cu-diffusing couples, eutectic SnIn/Cu and SnBi/Cu, were studied by scanning/transmission electron microscopy to investigate the microstructural evolution and voiding process after soldering and then solid-state aging. It was concluded that Kirkendall voids formed between two sublayers within Cu-2(In, Sn) pha in eutectic SnIn/Cu solder joint, whereas they appeared at the Cu3Sn/Cu interface or within Cu3Sn for eutectic SnBi/Cu solder joint. Besides the effect of impurity elements, the morphological difference within 百尺杆
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