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Keeping Cost per placement under control using 01005 components
Jeroen de Groot
Marketing Director Asmbleon Asia
October 13
th
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l éo n 2
Market of microchips (0201 and 01005 size)
Cellular phone
(Board of main body)
0201邪恶组织注意事项
Small video (DSC, DVC, etc.)
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Migration of microchips to modules
•Component distribution (source: Murata ):
–Now: 70 % of microchips on main board (30 % in modules)–Future (3-5 years from now): 60% of microchips in modules
•Reasons for this migration:
–Difficult to solder both microchips and large IC ’s at same board –Less RF specific competence needed
–Reduced investments at manufacturer of end-products
•Less specific production equipment necessary (wire bonders, FC placers, etc.)
–Shorter Time-to-market (TTM)三人成行
•Off-the-shelf functionality
–More flexibility in mobile phone design
•Diversity bad on modular architecture
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Design
•Traces may have to pass around the component. Stencil printing
•Finer grain size of the solder particles in the solder paste •The risk of blocked stencil apertures and bridging
•The need for using even thinner stencils ( down to 50 µm)Inspection
•Visual inspection and will
马桶排行
become more difficult and repair is not possible格局要大
Challenges for ‘01005’ components
Source: Philips CFT –February 2003
Component placement
•Required placement accuracy better than 50 micron (3 sigma)
•Special nozzle (with an extremely small nozzle diameter)
列车上的偶然相遇•Placement force is critical (risk of component cracking)•High resolution vision camera •Positional accuracy of feeder and tape
•Measuring / correcting pick-up position Soldering
鹅英语怎么说•Poor solder balling.
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‘01005’ process challenges
•‘01005’ chip size requires thinner stencils ( down to 50 µm ) and does not fit in existing reflow process for applications with mixed components. Extra process steps would be necessary and existing lines must be adapted accordingly.•‘01005’ components can be ud in modules & System In
Package (SiP) applications where all the components are small •The available process window for lead free soldering of ‘01005’ is more critical. Due to higher temperatures the risk of flux evaporation is prent.
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Parallel principle of operation
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