Power miconductor module and associated manufact

更新时间:2023-07-02 21:28:01 阅读: 评论:0

专利名称:Power miconductor module and
associated manufacturing method
发明人:LEDERER, MARCO,POPP, RAINER
申请号:EP07002024.3
申请日:20070131
公开号:EP1840961A3
有关秋天的词语公开日:
20080423
专利内容由知识产权出版社提供
专利附图:
摘要:the invention describes a leistungshalbleitermodul with a first
kunststoffformk\u00f6rper outwardly and a cond kunststoffformk\u00f6rper leading connecting with at least a anschluslement as a contact with a first kontakteinrichtung, a
车辆购置税计算resilient ction and a cond kontakteinrichtung is trained.the first
kunststoffformk\u00f6rper has at least one perpendicular to a substrate and shaft to absorb a anschluslements.the shaft has a lateral ausnehmung to verdrehsicheren arrangement of the anschluslements and a pocket for a corresponding object part will be the cond kunststoffformk\u00f6rper,with this object part will be also a lateral ausnehmung and on the substrate a ausnehmung behind for the first kontakteinrichtung of anschluslements in this round.
学前
申请人:SEMIKRON ELEKTRONIK GMBH & CO. KG有关大海的诗句
中国抗疫故事儿童编发图片地址:Sigmundstras 200 90431 Nürnberg DE
国籍:DE
关胜性格
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