Center for Imaging and Mesoscale Structures薄壳山核桃
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DISCO DAD321 Ur Manual
Important Note:
1. Don’t u the machine if you are not trained and qualified. 2. If you are qualified ur, but haven’t ud the machine at least once in the past four months, you will need to be retrained before you can u the machine again. 3. Schedule the machine before using it. 4. If you want to change the blade or cut special materials such as sapphire, plea contact CIMS staff (JD Deng, 5-3396). 5. Plea contact cleanroom staff immediately if anything is unusual: Jiangdong (JD) Deng: 617-495-3396, or Erli Chen: 617-384-7438
Machine Power Up
1. 2. 3. 4. 5. Turn on compress air. Make sure the air pressure is larger than 80psi Turn on city water for the machine Turn on city water for the chiller Turn on the chiller Open the splash cover and blade cover to check if the blade mounted is right type (the default blade type is G1A851). Make sure that the
re is not obviously damage around the blade edge. If the blade is damaged, call CIMS staff. 6. Turn the key switch to “START” position then relea. MAIN MEMU should show up on the screen.
Machine Preparation
1. 2. Initialization Press “SYS INIT” Key, wait until “Initialization Completed” appears on screen Warming Up a. From MAIN MENU, press “F4”. DEVICE DATA LIST MENU shows up on screen b. Select program “000” by using “µ” or “¶” key c. Press “ENTER”
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Generated by: Erli Chen
Center for Imaging and Mesoscale Structures d. Verify if the “SPINDLE REV.” is at 30,000 rpm
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e. Press “EIXT” twice to back up to MAIN MENU screen. “000” should show up under DEVICE NO f.
Press “SPNDL”; spindle starts to rotate g. Press “CUT WATER”; wheel cooling water turns on h. Leaving machine in this condition for 2 minuets before moving to next step 3. Condition Set Up a. Press “SET UP” and follow the instructions appeared on the bottom of the screen until t-up is completed. Note: If alarm turns on, silence the alarm by press “ALRMCLR”, then go to “Full Setup” ction of this manual
Modify Recipe
There are two recipes currently stored. Recipe “101” is ud to cut the entire piece defined by the sample size. Recipe “102” is ud to partially cut a sample. Modify Recipe “101” (Mode –A) 1. 2. 3. 4. From the MAIN MENU, press “F4” to DEVICE DATA LIST menu Select program “101” by using “µ” or “¶” key Press “ENTER” Verified or modify if necessary only the following fields: (To modify a field: move the cursor to the field, type the new value, then press “” key. Press “ENTER” key to confirm the modification) • • • “UNIT”: u F1 key to toggle between the units of “mm” or “inch” u F1 to toggle between “ROUND” or “SQUARE” the diameter of “ROUND” wafer (It “CUT SHAPE”: “RND WORK SIZE”: supporting substrate!) • “CH1” and “CH2”: the x- and y- dimension of “SQUARE” sample (It determines the cutting dimension! Therefore should be the size of the supporting substrate!) Rev. 2.0 (10-5-2004) 2 Generated by: Erli Chen
determines the cutting dimension! Therefore should be the size of the
Center for Imaging and Mesoscale Structures • • • • • “WORK THICKNESS”: shown in Figure 1. “TAPE THICKNESS”: shown in Figure 1. “BLADE HEIGHT”: “FEED SPEED”: Y_INDEX: CH1: CH2: X-axis cutting step size Y-axis cutting step size
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the thickness of your sample-to-be-cut, as thickness of the supporting substrate, as minimum distance between blade and chuck
table, as shown in Figure 1, should be larger than 0.3 mm. typically between 1 to 10 mm/s.
Blade
Blade Height Sample Tape (Supporting Sub.)
Vacuumed stage
Figure 1. Definition of ‘Blade Height’ 5. 6. Press “EXIT” twice; go back to MAIN MENU “101” should show up under DEVICE NO
Modify Recipe “102” (Mode-AS) 1. 2. From the MAIN MENU, press “F4” to DEVICE DATA LIST menu Select program “102” by using “µ” or “¶” key
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旦的成语
Center for Imaging and Mesoscale Structures 3. 4. Press “ENTER”
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Verified or modify if necessary only the following fields in this page: (To modify a field: move the cursor to the field, type the new value, then press “” key. Press “ENTER” key to confirm the modification) • • • “UNIT”: u F1 key to toggle between the units of “mm” or “inch” u F1 to toggle between “ROUND” or “SQUARE” the diameter of “ROUND” wafer (It “CUT SHAPE”: “RND WORK SIZE”: supporting substrate!) • “CH1” and “CH2”: the x- and y- dimension of “SQUARE” sample (It determines the cutting dimension! Therefore should be the size of the supporting substrate!) • • • “WORK THICKNESS”: shown in Figure 1. “TAPE THICKNESS”: shown in Figure 1. “BLADE HEIGH
T”: minimum distance between blade and chuck table, as shown in Figure 1, should be no less than 0.3 mm Thickness of the supporting substrate, as the thickness of your sample-to-be-cut, as
determines the cutting dimension! Therefore should be the size of the
5. 6.
Press F3, 2nd page (DATA2) shows up. In this page, you can define parameters for CH1 and CH2 Verified or modify if necessary only the following fields in this page: (To modify a field: move the cursor to the field, type the new value, then press “” key. Press “ENTER” key to confirm the modification) • • • • “CUT DIR”: Cutting direction. U F1 key to toggle between the direction toward “REAR” or “FRONT” “BLADE HEIGHT”: “θ AIXS”: “CUT LINE”: in the whole cut) minimum distance between blade and chuck table, should be no less than 0.3 mm. Cutting orientation Number of lines to be cut (if t to “0”, the system
turned into stroke control – cutting will start from the edge of the wafer as
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Center for Imaging and Mesoscale Structures • • “OFFSET”:
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the distance (offt) between the aligned position and the项目经理助理
first cutting line (effective only when “CUT LINE” not t to “0”) “NON-CUT AREA”: “F”: “R”: • • • 7. 8. 9. the front cutting prohibition area the rear cutting prohibition area
(effective only when “CUT LINE” t to “0”) “BLADE HEIGHT”: should be no less than 0.3 mm. “FEED SPEED”: typically between 1 to 10 mm/s. Smaller feed speed results in smoother cutting edge “Y INDEX”: cutting step size Press F4 to review and edit CH3 and CH4 Press “EXIT” twice, go back to MAIN MENU Confirm “102” under DEVICE NO
Load Sample
珠海攻略
1. 2. 3. Mount sample-to-be-cut on a supporting substrate Place the sample and substrate onto the chuck table Press “C/T VAC”, vacuum should apply to the substrate
Cut Sample
There are two cutting options: F1 – Auto Cut F2 – Semi-Auto Cut Here are results of cutting combinations: F1 + 101: F2 + 101: F1 + 102: F2 +102: Two-direction (CH1-2) cut – from edge to edge (whole cut) One-direction (CH1 only) cut, from aligned position to edge of the wafer Multi-direction cut (CH1-4) – defined by DATA-2 and -3 One-direction (CH1) cut, start from aligned position to edge of the wafer (DATA-2 and -3 do not work) SEMI AUTO CUT (CH1 only – one directional) 1. Press F2 for SEMI AUTO CUT
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