Time 25 °C to peak temperature 8 min maximum
Ramp-down rate 6 °C/s maximum 30* s独赏
Peak temperature
动漫设计师>高清电脑桌面壁纸(Table 1)
PROFILE FEATURE LEAD (Pb)-FREE ASSEMBLY 3 °C/s maximum
刘连满
油炸带鱼段的做法REFLOW PROFILE
唉唉Note: All temperatures refer to topside of the package, measured on package body surface
*Tolerance for peak pro file temperature (Tp) is de fined as a supplier minimum and a ur maximum.Time within 5 °C of actual peak temperature (t P )*
Time maintained above
- Temperature minimum (T L )- Time (T L )
217 °C 60 s to 150 s
Average ramp-up rate (T L to T P )Preheat
- Temperature minimum (T S(min.))- Temperature maximum (T S(max.))- Time (T S(min.) to T S(max.)) (t S )
150 °C 200 °C 60 s to 120 s
盐城人民公园CLASSIFICATION REFLOW PROFILE
PACKAGE CLASSIFICATION REFLOW TEMPERATURE TABLE 1 - LEAD (Pb)-FREE PROCESS
* Tolerance: The device manufacturer/supplierer shall assure process compatibility up to and including the stated classification temperature at the rated MSL level
WAVE SOLDERING
Fig. 1 - Lead (Pb)-free Wave Soldering Profile
Notes:
1. Package volume excludes external terminals (balls, bumps, lands, leads) and/or non-integral heat sinks.
2. The maximum component temperature reached during reflow depends on package thickness and volume. The u of convection reflow process reduces the thermal gradients between packages.
However, thermal gradients due to differences in thermal mass of SMD packages may still exist.3. This document should rve as recommendation only.
Other parameters may also affect soldering, so the profiles do not guarantee absolute success.4. Soldering profile should be determined by the manufacturer of the solder paste, providing there is no contradiction with the recommendations in this document.5. Reflow profile reference to J-STD-020 Wave soldering reference to CECC00802
≧2.5mm
250 +0 ℃*
245 +0 ℃*
245 +0 ℃*
VOLUME mm 3
> 2000260 +0 ℃*< 1.6mm - 2.5mm
260 +0 ℃*250 +0 ℃*245 +0 ℃*PACKAGE THINKNESS VOLUME mm 3
捕鱼儿海之战
<350VOLUME mm 3350 - 2000< 1.6mm 260 +0 ℃*260 +0 ℃*
