专利名称：FORMATION OF BUMP FOR LEAD OF SEMICONDUCTOR CHIP教育性教学
发明人：SASAOKA KENJI
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申请号：JP15251589
申请日：19890615曼妮姐妹
段子手公开号：JPH0318030A
公开日：
19910125
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苍马山专利内容由知识产权出版社提供
摘要：PURPOSE:To easily cover with bumps for leads having uniform shapes and sizes by dropping melted gold (Au) at predetermined positions on a miconductor chip surface from a predetermined nozzle, and covering the predetermined positions on the chip surface with the droplets to be solidified. CONSTITUTION:Since melted Au is dropped at predetermined positions on a miconductor chip 2 surface from a predetermined nozzle 3, bumps 2 for leads can be always formed with predetermined quantity of the melted Au. That is, the dropped Au amount can be controlled to be constant by lecting a nozzle diameter 3, or tting or lecting the fluidity of the melted Au. Accordingly, the shapes and sizes of the formed bumps 2a can be not only easily made uniform, but the dropped melted Au can be held in a mispherical or relatively thick state near it by the surface tension of the dropped melted Au to be solidified. Thus, easy and effective connections are achieved at the thermal press-adherence with a tapelike circuit board, and reliability of circuit components is improved.
申请人：TOSHIBA CORP
负责的近义词>李氏王朝
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