Appendix A Recommended PCB Design Rules
BGA Packages
Xilinx provides the diameter of a land pad on the package side. This information is required prior to the start of the board layout so the board pads can be designed to match the
component-side land geometry. The typical values of the land pads are described in
Figure A-1 and summarized in Table A-1 for both 0.8 mm and 1.0 mm pitch packages. For Xilinx BGA packages, non-solder mask defined (NSMD) pads on the board are suggested to allow a clearance between the land metal (diameter L) and the solder mask opening
(diameter M) as shown in Figure A-1. An example of an NSMD PCB pad solder joint is shown in Figure A-2. It is recommended to have the board land pad diameter with a 1:1 ratio to the package solder mask defined (SMD) pad for improved board level reliability. The space
between the NSMD pad and the solder mask as well as the actual signal trace widths
depend on the capability of the PCB vendor. The cost of the PCB is higher when the line width and spaces are smaller
陌生的城市Figure A-1:Suggested Board Layout of Soldered Pads for BGA Packages
博兴二中
Chapter 5:Thermal Specifications
Appendix A:Recommended PCB Design Rules
Figure A-2:Example of an NSMD PCB Pad Solder Joint
Table A-1:BGA Package Design Rules
Packages
茄子的10种家常做法0.8 mm Pitch 1.0 mm Pitch
SB/SBG/SBV, CL/CLG FF/FFG/FFV, FB/FBG/FBV, RF/RFG过年的意思
Design Rule Dimensions in mm (mils)
怎么看显示器尺寸
水瓶和天秤Package land pad opening (SMD)0.40 mm (15.7 mils)0.53 mm (20.9 mils) Maximum PCB solder land (L) diameter0.40 mm (15.7 mils)0.53 mm (20.9 mils) Opening in PCB solder mask (M) diameter0.50 mm (19.7 mils)0.63 mm (24.8 mils) Solder ball land pitch (e)0.80 mm (31.5 mils) 1.00 mm (39.4 mils) Notes:
1.Controlling dimension in mm.
Figure B-2:
Recommended Method For Using Pick-up Tools孕早期怕冷
Heat Sink Attachment Process Considerations
After the component is placed onto the PCBs, when attaching a heat sink to the lidless package, the factors in Table B-2 must be carefully considered (e Figure B-3).
Table B-2:
Heat Sink Attachment Considerations
气喘吁吁拼音
Consideration(s)
Effect(s)
Recommendation(s)
In heat sink attach process, what factors can cau damage to the expo die and
passive capacitors?
•Uneven heat sink placement •Uneven TIM thickness •Uneven force applied when placing heat sink placement •Even heat sink placement •Even TIM thickness
•Even force applied when placing heat sink placement
Does the heat sink tilt or tip the post attachment?
Uneven heat sink placement will damage the silicon and can cau field failures.•Careful handling not to contact the heat sink with the post attachment.•U a fixture to hold the heat sink in place
with post attachment until it is glued to the silicon.
Figure B-3:
Recommended Application of Heat Sink
