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专利名称：Semiconductor package having a heat slug
and manufacturing method thereof
发明人：Ki-Won Choi
申请号：US11233949
申请日：20050923
公开号：US20060063306A1
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专利内容由知识产权出版社提供
初中周记怎么写
专利附图：
摘要：In one embodiment, a circuit substrate strip includes molding blocks compod of a plurality of circuit substrate unit areas. An integrated circuit chip is attached onto each circuit substrate unit area and connected electrically thereto and a heat slug is
32太极拳attached thereon. Resin alant is applied on the molding blocks by group molding and the cover of the heat slug is expod out of the upper surface of the resin alant. At each corner of the circuit substrate unit area, a supporter ba is formed. Supporters extending downwards from the four corners of the cover are connected onto a supporter ba. After formation of solder balls, the circuit substrate unit areas are parated into individual miconductor packages by cutting the circuit substrate strip.
申请人：Ki-Won Choi
地址：Gyeonggi-do KR
籁的读音国籍：KR
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