Reusable encapsulation layer support plate and met

更新时间:2023-06-24 18:35:42 阅读: 评论:0

专利名称:Reusable encapsulation layer support plate
and method of encapsulating OLED
substrate
发明人:Wei Wang
画地为牢的意思
申请号:US14527556
申请日:20141029
公开号:US09419222B2
公开日:
袁隆平观后感
20160816查询注册公司>庆字组词
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专利附图:
摘要:The embodiments of the prent invention disclo a reusable encapsulation layer support plate comprising: a support plate body, the top of the support plate body
being arranged with at least one first opening for accommodating an encapsulation layer;
a cavity arranged within the support plate body, the cavity being filled with a porous material, and the top of the cavity having at least one cond opening; wherein the first opening is connected with and arranged opposite to the cond opening, and the top surface of the porous material is parallel and level with the bottom surface of the first opening. The encapsulation layer support plate can avoid crash of OLED substrate, realize effective OLED encapsulation, and can be reud as far as possible. The embodiments of the prent invention further disclo a method of encapsulating an OLED substrate using the encapsulation layer support plate.团结之力
申请人:BOE TECHNOLOGY GROUP CO., LTD.
强化同义词
地址:Beijing CN
国籍:CN核桃种子
代理机构:Blakely Sokoloff Taylor & Zafman, LLP
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