专利名称：DIE BONDER
发明人：OTSUKA MASAHIKO,TANAKA MASAYUKI 申请号：JP31679090
申请日：19901121
人工智能的定义公开号：JPH04186850A
鲜花花语
公开日：
天蝎座射手座
19920703
武则天二级专利内容由知识产权出版社提供
摘要：PURPOSE:To put a die bonder excellent in miconductor adhesion and suitable for mass production process to practical u, by providing each of the specified cover, blow plate, and heater block. CONSTITUTION:The following are provided; a cover 1 provided with an inrtion inlet 7 for wax collet and an inrtion inlet 8 for chip collet, a blow plate 2 which is arranged under the cover 1, retains a carried lead frame 3, and is provided with a plurality of gas nozzles 12 which are arranged in a rectangle type so as to surround a first and a cond heater block engaging holes 9, 10 arranged in the facing positions of the above-mentioned inrtion inlets 7, 8, and spout mixed gas of hydrogen and nitrogen, and a first heater block 5 and a cond heater block 6 which contain a plurality of bar heaters 13, move up and down the engaging holes 9, 10 opened in the blow plate 2, come into contact with the lead frame 13 and heat it. Further, for example, a quenching circuit which interrupts the supply of hydrogen gas by a signal from a fire detector is added.跟我来英文
申请人：FUJITSU LTD,FUJITSUU YAMANASHI EREKUTORONIKUSU:KK
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