专利名称：Single-core two-side substrate with u-strip and co-planar signal traces, and power and
ground planes through split-wrap-around
(SWA) or split-via- connections (SVC) for
packaging IC devices
沙漠狐发明人：John H. Lau,Yung Shih Chen,Tai-Yu
Chou,Frank H. Wu,Kuan Luen Chen,Wei H.
Koh
申请号：US08/795478实习课程
什么样的枫叶>新农合医保查询
猴跟马相配吗>荷兰生活申请日：19970211
公开号：US05825084A
公开日：
19981020
专利内容由知识产权出版社提供
我愿化作摘要：The prent invention disclos a new substrate with two metal layer circuit structure and layout for miconductor packaging. The speed and performance characteristics of the miconductor device are optimized while the packaging structure is simplified by utilizing only one dielectric layer and conventional printed circuit board fabrication process. The difficulties encountered due to the complexities and higher cost of production required for the multiple layer and high density configuration are thus avoided. The improved circuit structure is achieved by implementing a gmented ring on one side of a substrate and a split plane on the other side thus fo
rming a single layer substrate structure. The edges of the substrate are coated with metal layer to provide inter-layer connections. In addition to the benefits of high performance, low cost, the improved circuit structure and package layout provide flexibility allowing higher degree百度恶意点击
of freedom for lecting the location and number of input and output signal lines and connections to the ground and power planes from the miconductor device.
申请人：EXPRESS PACKAGING SYSTEMS, INC.
代理人：Bo-In Lin
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