专利名称：High power electronic package with
enhanced cooling characteristics内容英语
发明人：Michael A Jeter,Ralph S. Taylor
申请号：US10931667
申请日：20040901
公开号：US06943293B1
公开日：一点知识
20050913紫的组词
专利内容由知识产权出版社提供
怦组词专利附图：
摘要：A power electronics module includes a heat sink and an electronic package having a first layer in direct thermal communication with the heat sink. At least one
electronic component is dispod between the first layer and a cond layer. A thermally
司法考试题conductive element is in direct thermal communication with the cond layer and carries heat from a first portion of the cond layer to a cond portion of the cond layer such that the heat is transferred from the cond portion of the cond layer to the heat sink through the first layer.
杨洋壁纸申请人：Michael A Jeter,Ralph S. Taylor
地址：Kokomo IN US,Noblesville IN US
国籍：US,US
代理人：Stefan V. Chmielewski
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