一岁小公主生日祝福语专利名称：Ultra high density integrated circuit
packages
发明人：Carmen D. Burns
申请号：US09434534
申请日：19991105
公开号：US06168970A
约会地点公开日：
20010102
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专利附图：
摘要：Thin and durable level-one and level-two integrated circuit packages are咯血病
provided. A thin and durable level-one package is achieved in one method involving a molding technique of evenly applying molding compound to an integrated circuit die
家用燃气报警器element. The casing surrounding a die element may be reduced or eliminated in part to thin the level-one package provided any necessary steps are taken to ensure the integrity of the package. Moisture-barriers, as an example, may be provided to the upper and/or lower surfaces of the thin level-one package. Additionally, a thin level-one package may also be constructed with one or more metal layers to prevent warpage. The level-one packages may be aligned in a stacked configuration to form a thin and durable horizontal level-two package. Various thermal conductors may be thermally coupled to the level-two package to help dissipate heat.
申请人：STAKTEK GROUP L.P.出戏是什么意思
送妈妈的花代理机构：George & Donaldson, L.L.P.
代理人：J. Scott Denko图片卡通可爱
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