灯笼的制作专利名称：COPPER METALLIZATION UTILIZING REFLOW ON NOBLE METAL LINERS 发明人：Rohan Akolkar,Florian Gstrein,Boyan Boyanov,Sridhar Balakrishnan
五年级数学小论文申请号：US11968136
审计助理申请日：20071231我的理想医生
茶叶的包装
公开号：US20090169760A1
公开日：
多肉黑腐
20090702
专利内容由知识产权出版社提供
摘要：Methods for making copper (Cu) interconnects in miconductor devices for interconnect dimensions less than 50 nm are described. The process form Cu interconnects using a quence of barrier layer, liner layer, and Cu deposition layer depositions, followed by a thermally assisted Cu reflow of the Cu deposition layer, and then a chemical mechanical polish (CMP) to removed excess portions of the reflowed Cu. The liner layer compris noble metals such as Ru, Ir, Os, Rh, Re, Pd, Pt, and Au. Such process avoids the formation of voids in copper interconnects with dimensions less than 50 nm.
申请人：Rohan Akolkar,Florian Gstrein,Boyan Boyanov,Sridhar Balakrishnan
种太阳
地址：Hillsboro OR US,Portland OR US,Portland OR US,Portland OR US
国籍：US,US,US,US者打一成语
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