工厂英文经典知识缩写

更新时间:2023-06-12 17:20:14 阅读: 评论:0

lol当前版本英文经典知识缩写
AF    Acceleration factor
ALT      Accelerated life test
ANOVA      Analysis of Variance
AOQL    Average Outgoing Quality Level
APO    Auto Power Off
APQP    Advanced Product Quality Planning and Control Plan
ARE      Area Options
ASIC      Application Specific Integrated Circuit
ASSP      Application Specific Standard Part
ATE    Automatic test equipment
ATO    Asmbly To Order
AVL    RFQ IMPUT CHECKLIST里面用到
BAC      Backup
BCI    Bulk current injection
BD    Business Developer
BFR      Batch Failure Rate
bo      Bochum
BOM      Bill of Material
BU      Business Unit
c      acceptance level (= number of failed components accepted)
CBD    Cost Break Down
CDM    Contract Design Manufacturer
CDM      Charge Device Model –discharge type
CDM      Original Design done by Partner specifically to support Nokia
CDN      Coupling and Decoupling Network.
CE    Concurrent Engineering
CE      Concurrent Engineering (ud for product development)
CE. E0...E5      Concurrent Engineering (CE) Product Program Milestones
CEM    Contract Electronic Manufacturer
CER. FILTERS,  MONOBL. DUPLEXERS      Powder mixing, Block pressing, Firing 
CI    Capacity Implementation
CIM      Custom In Mould
CLUSTER      Group of companies, head by one Cluster leader
CM    Cost Management
CMO    Customer & Market Operations
co      Copenhagen
COC      Certificate of compliance
COO    Country of Origin
Cp, Cpk    Process Capability indices
Cpk      Capability Index
CPL      Cost Part list
CQE    Component Quality Engineer
CQP    Component Quality Planning
CQS    Component Quality Specialist
CR      Change Request
CRR      Component review report
CRYSTALS    Crystal wafer manufacturing
CSA    Current State Analysis
CSM   
C-TPAT    Customs-Trade Partners Against Terrorism
CTS    Cost Target Setting
D        Draft, first version of the document
da      Dallas
DC    Direct
DC      Direct Current
DCN      Design change notice
DES      Delect all土壤污染的特点
DFA      Design For Asmbly
DFBA      Design for Board Asmbly
DFDS      Design for Demand Supply
DfE    Design for Environment
DFFA      Design for Final Asmbly
DFM      Design For Manufacturing (includes DFPT, DFBA, DFFA)
DFMEA    Design Failure Mode and Effects Analysis
DFPT      Design for Production Test
DG   
DI-EL. DUPLEXERS      Resonator preparing
DIR    Design Improvement Reports
DocMan      Type of Lotus Notes databa (for documents)
DOE    Design Of Experiment
DOE      Design Of Experiment
DPM      Defects Per Million
DSB    Demand Supply Balance
DSN    Demand Supplier Network
DUT      Device Under Test
DV    Demand Volume
DVR   
E0...E5    Concurrent Engineering (CE) Milestones
E0..E5      Concurrent engineering (CE) milestones
ECN    Engineering Change Notice
EFR    Early Failure Rate
ELMECH    Electro Mechanical
EMC    Electro Magnetic Compatibility
EMI    Electro Magnetic Interference
EMS    Environmental Management Sys-tem
EN      European Norm
EoL    End of Life
EPA      ESD protected area
ERP   
es      Espoo
ESD      Electrostatic discharge
ESDS      Electrostatic discharge nsitive device
ESI    Early Supplier Involvement
ETA      Estimate to be arrive
EUT    Equipment Under Test
EV      Enclod volume
EVM    Enhancements Version Management
F        Final, document to be archived
FA    Failure Analysis
FAC    Fully anechoic chamber
FAQ    Frequently Asked Questions
FAI      First article inspection
FEM    Finite Element Modelling
FFR    Field Failure Rate
FIL      Filter..
FIML      Fabric Inmold Labeling, same with CIM Custom In Mould
FIT      Failures in Time
FMEA    Failure Mode and Effect Analysis
FOR   
FOT    第一次试模
FR      Failure Rate
G.A.    General Asmbly
Gauge R&R      Gauge Repeatability and Reproducibility
GCPM   
GD&T    Geometrical Dimensioning & Tolerances
GRP      ground reference plane
GRR    Gauge Repeatability and Reproducibility
HBM    Human Body Model
HBM      Human Body Model –discharge type
HCP    horizontal coupling plane
HIGH      Highlight lected
hk      Hong Kong
HUB      Warehousing and Shipping functionality location
ICDR    Integrated Circuit Design Reviews
ICDR      IC Design Review
夏天的水果ID    Industrial Design
IFR    Intrinsic Failure Rate
IMD    Inrt Mold Decoration
IME    Inject Mold Equipment
IML    Inrt Mold Labeling
IML      IN MOLD LABELING
IPQC    In Process Quality Control
IPR    Intellectual Property Rights
ISO      International Standardization Organization
jk        Jyväskylä
JR&D      Joint Rearch and development
KCR    Key Component Review
冰菜种植KO    Kick Off
LA    Licen Agreement
神雕olla      Los Angeles
LAB      Label
LCL      Lower Control Limit
LL      Lesson Learned
LRVP      Long Range Volume Plan
LSL      Lower Specification Limit
LSSE      Light SW Subcontractor Evaluation
M&O    Mechanics & Outsourcing
M/C    machine
M3      Global quality databa
MAR    Mechanics Acceptance Report
MAR’s    Mechanical Acceptance Report’s
MatCoMa   
MC    Measuring Centre
MD    Mechanics Desgin
MDF    Material Data Form
MDFs      material data forms
ME    Manufacturing Engineer
MECH    Mechanics
MFI    Melt flow index
MIS   
MM      Machine Model –discharge type
MOR    Monthly Operation Review
MOSS      Visual Quality Criteria’s procedure
MPL    Material Project Leader
MPL / M      Material Project Leader / Manager
MPL/MPM    Material Project Leader/ Manager
MPM      Material Project Manager
MR    Measurements Report
MRPⅡ   
MS    Manufacturing Solutions
MS    Milestone
MSA    Measurement System Analysis
MSID    Moisture-Sensitive Identification
MSM    Mechnical Supplier Management
MSM      Mechanics Sourcing Manager
MTO    Make TO Order
MTS    Mechanical Technology Sourcing
MULTIL.PRODUCTS    Ceramic powder manuf, Sheet forming, Cutting, Printing, Firing
NC    non connect
NCT   
NDA      Non Disclosure Agreement
NET      Nokia Networks
大正时代NET      Networks
NGP    Nokia Global Process
NGS    Nokia Global Standards
NGSW      Nokia Global Supplier Web
NMP       Nokia Mobile Phones Ltd
NOSS      Nokia Supplier Status databa
NPI    Nokia Product Integration
NPI    New Product Introduction
NPSQS    Nokia Part Specific Quality Standards
NRT    Nokia Rapid Tooling
NSL    Nokia Substance List
NSM    Nokia Supplier Manual
NSR    Nokia Supplier Requirement
NTP    Normal temperature and pressure, e laboratory environment
OAP      Original Accessory Partner
OCAP       Out-of-Control Action Plan
OCV    Open Circuit Voltage
ODM    Original Design Manufacturer
ODM      Original Design done by Partner independently
OEM      Original Equipment Manufacture
OEM      Original Design done by Nokia
OPL    Operations Project Leader
OQC      Outgoing Quality Control
ORS      Operating Resource Sourcing
OT      Over time
OTD      On time delivery
ou      Oulu
PA    Process Asssment
PA    Product  Agreement
PC    Product Creation
PC      Polycarbonate
PCBA   
PCN    Process Change Notice
PCNs    product change notification cas
PCQE      Program Component Quality Engineer
PCQM      Program Component Quality Manager
PD    Product Delivery
PDM    Product Development Manager
PDM    Product Data Management
PDM    Product Data Management System
PDT    Project Development Team
PE      Product Engineering (ud for product in mass production)
PFMEA    Process Failure Mode and Effect Analysis
PGP      Pretty Good Privacy
PI    Product Implementation
PIR   
PLM    Product Line Management
PLP    Product Lifetime Profitability
PLRM    Program Loading Road map
PM    Product Manager
PM    Purchasing Manager
PM    Project Manager
PM/MP      Partner Manufacturing/Manufacturing Partner
PMA    Project Manager Assistant
PMC   
PMM    Program Portfolio Management
PMT    Project Management Team
PO    Purchasing Order
POKA-YOKE    Mistake Proofing
POP    Package Operation Procedure
Pop-Port      System connector in NOKIA mobile devices
POWER AMPS      MMIC and/or IC manufacturing
Pp, Ppk    Process Performance Indices
PPA      Product Purcha Agreement
PPAP    Production Part Approval Process
PPM    Product Program Manager
ppm      Parts per million
PQ    Process Qualification
PQGFP    Package qualification guideline for programs
PQM    Program Quality Manager
PQP    Program Quality Plan
PQP    Package Qualification Procedure
PR1/2   
PTO    Package TO Order
PV       Product Validation 
PVD    Physical Vapor Deposition
PWB    Printed Wire Board
QA    quality assuren
QBR    Quarterly Business Review
QC    quality control
QE    Quality Engineer
QFD      Quality Function Deployment
QM    quality management
QSR      Quality System Requirement
QTE    Quality Technician Engineer
QTE      Quality and Technology Engineer
QTE / QTM    Quality Technology Engineer / Manager
QTE / QTM      Quality Technology Engineer / Manager
QTM      Quality and Technology Manager
QTY    Quantity
R&D      Rearch and Development
R&R      Roles and Responsibilities
R&T    Rearch and Technology
RAM    Random Access Memory
Ramp Up/SA   
REC      Reconsider
REL      Related to
RFP    Request For Proposal
RFQ    Request For Quotation
RIPS    Recently Introduced Product Support
RMA    Return Material Authorization
SA   
SAC    mi anechoic chamber
SAW /BAW FILTERS, SAW DUPLEXERS      Die wafer manufacturing
SCP    Service Channel Preparation
SEM    Scanning  Electron  Microscope
SG      Save as group
SHO      Show
si      Singapore
SID   
SIP    Standard Inspection Procedure
SLI      Supply Line Implementation process
SLM      Supply Line Management
SLP    Supply Line Preparation process
SO    Solution Offering
SOP    Standard Operation Procedure
SOW      statement of work
SPC    Statistical Process Control
SPPM    Senior Product Program Manager
SPR      Standard Product Requirement (Nokia)
SQA    Supplier Quality Assurance
SQC    statistical quality control
SQE    Supply Quality Engineer
SQM    Supply Quality Manager
ss    sample size
STA    Short Term Availability
SVP    Senior Vice President
SW    Software
sy      Sydney
TCRM    Technology Competence Roadmap
TEC    Technology Platform
to      Tokyo
TP    Technology Platform
TPE   
TPR    Technical Product Requirement
TPU   
tre      Tampere
U        Update, all updated documents that are not final
U/I      Voltage / Current
U/I      Voltage / Current
UCL      Upper Control Limit
UG      U group
UI    Ur Interface售楼潜规则
ul      Ulm
vc      Vancouver¨
VCO      IC manufacturing (discrete transistors, other ICs)
VCTCXO      Crystal wafer and IC (LSI-VCTCXO) manufacturing
VIS      Visible
VPQCT    Volume Production Quality Control Test
VQD    Visual Quality Engineer
VQE      Visual Quality Engineer
VQR    Visual Quality Requirements
忠犬的原则WBS    Work Breakdown Structure

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