伙伴们来⼀起学习晶圆级封装（WLCSP）Hello Ladies and Guys Let Us to learn WhatWLCSP Is?
(Wafer Level Packaging)
三件套Evolution of packaging
Advantages of standard WLCSP
Wafer Level Package – Structure
Cross Section
Commercial Photo-polymers
CSP Process Flow
CSP Process Spec
BCB spec
BCB coating:Thickness:3.5~6.5um,average:5um
BCB thickness depend on PI thickness心的痕迹
中国名媛Sputter spec
延迟月经吃什么药Ti thickness:uniformity:-5%~+5%(within wafer,wafer towafer,run to run) Cu thickness:uniformity:-5%~+5%(within wafer,wafer towafer,run to run) RIE spec
BCB descum:Non-uniformity<7%
PR etch:Non-uniformity<10%[ Non-uniformity:(Max-Min)/2*Average PR spec
PR coating:Thickness:18~20um,average:20um
BCB developing:side wall angle>65 degre e
银杏叶分散片
PR opening>=BCB opening+5um
Plating spec
Cu thickness:Uniformity<10%
Ni thickness:Uniformity<10%
Au thickness:Uniformity<10%
SM spec
SM printing:thickness:40um
出纳什么意思SM developing:side wall angle>70 degree
Dicing spec
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中国传统文化绘画
Surface chipping length<20um
Backside chipping length <50um
