IPCWorks2005-
什么貂皮最好
Las Vegas, NV
John Andresakis, Takuya Yamamoto,Kaz Yamazaki-Oak-Mitsui Technologies Yoshi Fukawa, Glenn Bennik-TechDream, Inc.
INTRODUCTION
不织布作品•Buried Capacitance Drivers
•Material Properties
•PCB Manufacturing Process
•Impedance/Noi Measurements
•Simulation Results
•Further Studies
•Conclusion
High speed computing boards Module boards
Servers, Routers, Super computers Cell phones, PDA, Note book computers CPU processor speed
Operation voltage
Power consumption
Power distribution improvement
Multiple band
More functions
Cost
Miniaturization / HDI
Background / Motivation
Embedded capacitor Embedded capacitor
Background of demand for PCB with Embedded Capacitor
“Thin”power ground plane is the key parameter to improve electrical
performance at high frequency!
⊿V=I*R +L *di/dt
V
Voltage Regulator
Power Ground
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IC
最早的人类Embedded capacitance layer 0.5 1.0 1.5 2.0 2.5 3.03.5 4.0 4.5 5.0
Itanium
小狗断尾ITRS 2010
表示惊讶的词语Athalon
二次元女生图片
Pentium 1486
386
Voltage
P o w e r (W )Voltage is decreasing
河南征兵Time
Allowable ⊿V is ±5%of Voltage
⊿V Will increa as clock speed increa
50
100150
ITRS, Swaminathan etal.
⊿V<50mV
⊿V<250mV
L ∝Loop area ∝Power ground thickness
⊿V<500mV
Background of demand for PCB with Embedded Capacitor
High capacitance and capacitance uniformity is the key to embed
Source: Richard Ulrich University of Arkansas
Component density is reaching its limit
Passive components
